The 88W8977 from NXP is a WLAN (2.4/5 GHz) and Bluetooth System-on-Chip (SoC) that has been specifically designed to support the speed, reliability, and quality requirements of next-generation products. It provides both simultaneous and independent operation of the IEEE 802.11n compliant 1x1 spatial stream and Bluetooth v4.2, as well as planned enhancements of Bluetooth technology including features such as higher speeds, and mesh networking for increased Internet of Things (IoT) functionality. The device also provides or 3-way coexistence for WLAN, Bluetooth, and ZigBee operation.
This SoC is available in QFN and eWLP package options with SDIO 3.0 and high-speed UART interfaces for connecting WLAN and Bluetooth technologies to the host processor and is ideal for mobile, wearables, IoT, IP cameras, and smart home applications.