The S5 Sound Platform from Qualcomm is a Bluetooth LE Audio Module that is based on a Bluetooth 5.3 dual-mode radio. It supports Snapdragon Sound technology to deliver premium audio in all environments even where there could be interference from many other devices. This module uses third-generation Qualcomm Adaptive Active Noise Cancellation (ANC) that seamlessly adapts to wind noise, and transparency depending on the users' environment and prevents howling noises. It utilizes Qualcomm aptX Voice Audio to deliver super wideband voice quality with 32 kHz sampled audio and a flat 16 kHz frequency response. It also supports up to 3-microphones and has Qualcomm cVc Echo Canceling and Noise Suppression (ECNS) which uses beamforming to cleanly capture the sound. The module also supports Qualcomm TrueWireless Mirroring technology and also offers a wireless voice-back channel for in-game chat.
The S5 Sound Platform delivers a data rate of up to 3 Mbps (Bluetooth EDR) with a latency of 68 ms for wireless audio to fully synchronize the audio experience with on-screen actions. This module has a 32-bit programmable app Dual-Core CPU with a clock speed of up to 80 MHz, external flash memory, and a Dual-core 240 MHz programmable DSP audio subsystem. It can be controlled via 24-bit audio interfaces or a USB interface. This module is available in a WLCSP package that measures 4.930 x 3.936 x 0.57 mm and is ideal for compact and feature-rich wireless earbuds, headsets, and speakers.
