TC35679IFTG-002

Wireless Chipset by Toshiba (3 more products)

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TC35679IFTG-002 Image

The TC35679IFTG-002 is a Bluetooth Low Energy IC that has been developed for Automotive applications. This ultra-low power Bluetooth IC supports secure connections, LE privacy features and extended packet length. It is available for use in harsh automotive environments and operates at extended temperature ranges. It contains both analog RF and baseband digital parts to provide a complete solution in a single, compact and low-profile, 40-pin 6mm x 6mm x 1mm QFN package.

The wettable flank package simplifies automatic visual inspection needed to deliver the high levels of soldering quality required to withstand vibration experienced in automotive applications. Current applications include remote key systems and reducing cables by providing a reliable wireless connection to sensors. The device will also facilitate remote connection to diagnostic equipment, creating a Bluetooth 'soft' On-Board Diagnostic (OBD) port, thereby saving the cost and weight of the associated cabling and OBD connector.

Product Specifications

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Product Details

  • Part Number
    TC35679IFTG-002
  • Manufacturer
    Toshiba
  • Description
    Bluetooth Low Energy IC for Automotive Applications

General Parameters

  • Application
    Automotive
  • Technology
    Bluetooth
  • Frequency
    2400 to 2483.5 MHz
  • Bluetooth Standard
    Bluetooth V4.2
  • Bluetooth Application
    Non-Audio
  • Bluetooth Low Energy
    Yes
  • Sensitivity
    -93 dBm
  • Voltage
    1.8 to 3.6 V
  • Current Rx
    3.3 mA
  • Current Tx
    3.3 mA
  • GPIOs
    17 Ports
  • Interface
    I2C, SPI, UART, PWM, ADC
  • RAM
    83 kB
  • RF Transceiver
    Yes
  • ROHS
    Yes
  • Sleep Current
    100 nA
  • Dimension
    6.0 mm x 6.0 mm x 1 mm
  • Package
    40 Pin QFN wettable Flank
  • Pins
    40
  • Operating Temperature
    -40 to 85 Degree C (for 1.8 to 3.6 v), -40 to 105 Degree C (for 2.7 to 3.6 V)
  • Storage Temperature
    -40 to 125 Degree C

Technical Documents