IGaN Achieves Low-Conduction Loss with GaN-on-Si Epiwafer for RF Applications
In recent years, there has been a growing demand for GaN-based products stemming from the increased adoption of GaN power and RF devices in a variety of applications. From a military, defense, aerospace, and next-generation telecommunication, particularly with 5G network, GaN-based materials’ wide-bandgap offers remarkable breakdown electric field and high drift velocity suited for the fabrication of high power and high-frequency devices.
In terms of applications, III-nitride materials, i.e. GaN, are generally heteroepitaxial grown on a substrate. Among various substrate materials, the silicon substrate is widely selected for the growth of epitaxial stack comprising III-nitride materials due to the lower substrate cost and flexible scalability on the substrate size. From a material property viewpoint, differences such as thermal expansion coefficient and lattice constant between III-nitride materials and silicon substrate can pose technological challenges, i.e. crack, defect, wafer bow, and crystal quality for practical applications. Click here to read more.