A Solution for the Design, Simulation and Validation of Board-to-Board Interconnects
High Frequency Electronics, Samtec, Inc.
- Author:
Scott McMorrow and James Bell, Julian Ferry
In this article, we introduce the concept and realization of Final Inch™, a compre-hensive suite of design aids for the development of high performance board-to-board intercon-nects. Final Inch includes the following compo-nents: the connector, the breakout region (BOR), the test board, the modular modeling environment and simulation correlated to measurement. These tools and techniques were developed to help maintain signal integrity in the critical area around printed circuit board interconnections.
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