NXP Semiconductors has announced a collaboration with Murata, to develop RF front end modules for Wi-Fi 6 standards. Together, the companies are delivering a solution that can reduce design times, improve time-to-market and save board space in next generation Wi-Fi 6 implementations. The solution combines NXP’s front-end ICs (FEIC) and Murata’s integration expertise to deliver small, ultra-compact RF modules for Wi-Fi 6.
The NXP FEIC is tightly packed in a chip scale package (CSP) suitable for module integration and can support various 5G smartphones and portable computing devices. Additionally, it enables high performance 2x2 multiple input multiple output (MIMO) functionality.
NXP’s monolithic front-end ICs have been validated on leading Wi-Fi 6 platforms and offer perfect flexibility in terms of size and integration. Working with Murata helps them deliver a highly integrated, fully tested and qualified solution for 5G devices while providing the highest performance and smallest size to meet rapidly rising global demand for Wi-Fi 6.
About NXP’s WLAN11ax Portfolio
NXP enables the next step in Wi-Fi 6 implementations by providing a high performance WLAN 802.11ax portfolio to support customers in fulfilling the ever-increasing need for more bandwidth. By providing both the 2.4 GHz and the 5 GHz bands that fit the 802.11ax Wi-Fi 6 standard, NXP offers a flexible portfolio that scales across these specifications.
NXP offers 2x2 MIMO support for IEEE802.11a/n/ac/ax applications. Click here to learn more about NXP’s growing wireless local area network (WLAN) portfolio.
