StratEdge Corporation, a provider of high-frequency and high-power semiconductor packaging, has announced its participation in the IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS), October 27-30, 2024, in Fort Lauderdale, Florida. IEEE BCICTS will bring together leaders from across the semiconductor industry to discuss and demonstrate the latest advances in integrated circuit technology for applications across automotive, wireless, and aerospace sectors.
At IEEE BCICTS, StratEdge will highlight its robust lineup of thermally enhanced ceramic and molded semiconductor packages. Engineered to support critical applications from DC to 63+ GHz, these packages provide ultra-low-loss performance, dissipate heat efficiently, and deliver high-frequency reliability essential for today’s high-demand devices. With a broad selection of open-tooled designs available, StratEdge's packaging solutions support seamless integration and optimize performance across various mounting configurations. Of particular interest shown in the accompanying photograph is LL6845-10-3, a Leaded Laminate (LL) series package that was designed specifically for GaAs and GaN devices operating from 26.5-31 GHz.
"IEEE BCICTS is an invaluable forum for connecting with industry innovators who understand the importance of packaging that meets the exacting demands of high-frequency, high-power applications," emphasized Casey Krawiec, VP of Global Sales at StratEdge. "Our expertise in thermal management and high-frequency transmission line design, combined with our state-of-the-art Assembly Services, enables us to offer complete packaging solutions that enhance device performance and reliability. By leveraging our advanced wire bonding and die attach systems in a certified cleanroom environment, customers gain significant advantages in quality and efficiency."
IEEE BCICTS 2024 attendees are invited to visit StratEdge's exhibit, connect with their team of packaging experts, and learn how StratEdge can meet specific high-frequency packaging needs.
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