At IMS 2019, StratEdge Corporation is exhibiting its thermally-efficient line of post-fired and molded ceramic semiconductor packages. StratEdge packages operate from DC to 63+ GHz and dissipate heat from compound semiconductor devices such as gallium nitride (GaN), gallium arsenide (GaAs), and silicon carbide (SiC). These packages enable compound semiconductor devices to meet the critical requirements of markets such as telecom, mixed signal, VSAT, broadband wireless, satellite, military, test and measurement, automotive, down-hole, and MEMS.
StratEdge packages are developed to accommodate the extreme demands of compound semiconductor devices. The company manufactures its packages to exacting specifications, using hardened or post-fired ceramics that don’t shrink, substrates that dissipate heat, and electrical transition designs for exceptionally low electrical losses. To further ensure optimized performance, StratEdge Assembly Services can package devices in its new clean room, which is equipped with the latest precision wire bonding and die attach systems.
Click here to know more about StratEdge’s package solutions.
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