Nuvotronics, a subsidiary of Cubic Corporation, has been awarded the Best Industry Paper Competition Award at the IEEE MTTS-IMS 2019 conference in Boston for its paper, “Monolithically Fabricated 4096-Element, PolyStrata Broadband D-band Array Demonstrator.” The award goes out to work that potentially has the highest impact on a radio frequency/microwave product and/or system that will significantly benefit the microwave community and society at large.
In partnership with Nokia, Cubic’s Nuvotronics team demonstrated a PolyStrata-based 130-175 GHz flat-panel antenna array that is thinner than a dime. The paper was presented in Boston, Massachusetts by Author and Principal Investigator Jared Williams Jordan, during the IMS 2019 event.
On receiving the award, Martin Amen, Vice President of Strategy and Business Development for Nuvotronics, Cubic Mission Solutions, stated that the award is a true testament to how Nuvotronics’ industry-leading innovations offer substantially higher performance at a fraction of the size and weight of conventional millimeter-wave products.
As commercial and military communication providers look beyond 5G, they are exploring higher frequencies which support increased instantaneous bandwidth. The PolyStrata architecture provides an unrivaled platform for millimeter wave (30-300 GHz) integration and miniaturization, with 10 to 100 times the improvement in size, weight and power (SWaP). This paper highlights the ability of Nuvotronics to design, fabricate and test finely featured D-band radiating elements on approximately 1-mm pitch. First-pass processing yielded a defect-free, wafer-scale antenna/feed structure, micro-fabricated in pure copper for low loss.
