At the 2019 IEEE International Microwave Symposium (IMS) in June, JETCOOL Technologies unveiled their new approach to cooling computer processors and other electronics and won the title of Next Top Startup. Their technology could change the way the world cools the electronics powering aerospace, electric vehicles, and AI data centers.
The technology, known as microconvective cooling, uses small fluid jets that can be built within the electronic device. The result is ten times better cooling than today's state-of-the-art, which is welcome news to overclocking enthusiasts and high-power semiconductor companies alike.
JETCOOL (an MIT spinoff) introduced their cooling products at this year's International Microwave Symposium (IMS) in Boston. IMS is "the world's largest gathering of radio frequency (RF) and microwave professionals, and the most important forum for the latest advances and practices in the field, according to the IEEE. This year's event brought over 9400 guests and 600 companies showcasing their latest developments. JETCOOL took home top honors among startups, being named the Next Top Startup by a panel of expert judges that included VCs and technology executives. They also won the audience choice award for the best new technology startup.
The young company also gave technology followers a glimpse into something very exciting that with this new technology, it could be possible to build the heat sink into the silicon substrate itself.
Click here to learn more about JETCOOL.
