Mitsubishi Electric Corporation has announced the world’s first ultra-wideband transmission chipset with S/C/X-band capability, designed for multi-purpose wireless systems. The new chipset is expected to facilitate the downsizing of transmission modules and boost the transmission range of wireless systems. Technical details will be presented during the European Microwave Conference / European Microwave Integrated Circuits Conference (EuMC / EuMIC) 2019 commencing in Paris, France.
Key Features of the Ultra-Wideband Chipset
1. Novel amplifier configuration offering wideband characteristics:
- The amplifier incorporated in the new chipset is configured in two discrete stages; a distributed first stage amplifier and a reactively-matched second stage amplifier combine to provide ultra-wideband capabilities.
- A single new chipset comprising an amplifier and a switch covering a fractional bandwidth of 125 percent in S/C/X-bands will enable the downsizing of transmission modules.
2. Co-design of two chips provides high output power:
- Each chip is designed to reduce reflection loss when they are connected to each other; this co-design enables high output power while maintaining broadband characteristics.
- The chipset achieves an output power of over 20 watts as a transmission module, a high output level which will meet the demand for wide transmission range of wireless systems.
Mitsubishi Electric Corporation manufactures electrical and electronic equipment used in information processing and communications, space development and satellite communications, consumer electronics, industrial technology, energy, transportation, and building equipment.
More information about this chipset will be presented during the European Microwave Conference / European Microwave Integrated Circuits Conference (EuMC / EuMIC) 2019 in Paris, France. Click here to see everything RF's coverage of EuMW 2019.
