Mercury Systems has announced that it has received a $3.9 million multi-phase contract award from a leading defense prime contractor for the development of a high-density system-in-package solution for radar systems utilizing its novel 2.5D chip-scale integration technology. The award has an 18-month planned performance and shipment period.
According to Tom Smelker, Vice President and General Manager of Mercury’s Custom Microelectronics Solutions group, this game-changing technology will revolutionize applications such as artificial intelligence, and supports Mercury’s goal of bringing open standards architecture at chip-scale to the defense community.
The new system-in-package capabilities reinforce Mercury’s commitment to Innovation that Matters, as they make this traditionally commercial technology profoundly more accessible to the aerospace and defense industry and supports the DoD’s mandate for trusted microelectronics in defense systems.
The award is based on Mercury’s previously announced strategic investment in advanced microelectronics innovation. Critical to commercial and defense applications, Mercury has significant expertise in trusted manufacturing and can integrate requisite security with proven silicon fingerprinting capabilities, cryptographic protection capabilities, and on-shore silicon integration. When combined with major industry initiatives, such as trusted manufacturing, this chip-scale integration is highly complementary to Mercury’s longstanding expertise in system-scale processing capabilities.
