Attopsemi’s I-fuse Memory Solution Qualified and Available on X-FAB’s 130nm RF-SOI Process

Attopsemi’s I-fuse Memory Solution Qualified and Available on X-FAB’s 130nm RF-SOI Process

X-FAB Silicon Foundries, a leading analog/mixed-signal and specialty foundry, together with Attopsemi, innovator of I-fuse™ one-time programmable (OTP) IP solutions, have collaborated to meet the memory requirements of 5G technology. The companies have announced successful qualification of Attopsemi’s I-fuse OTP memory in relation to X-FAB’s XR013 open-platform foundry 130nm RF-SOI technology. This qualification will allow customers to benefit from the incorporation of a compact (<0.2 mm2 surface area) and robust OTP block into the core XR013 technology module, but without requiring additional or custom processing. Read operation is possible at both 2.5V and 1.8V for MIPI compatibility.

X-FAB’s XR013 is a feature rich, open-platform, 130nm technology that is optimized for RF applications. These include cellular infrastructure, Wi-Fi connectivity, automotive V2X communications, IoT, etc. The cooperation between Attopsemi and X-FAB presents greater scope for designers to integrate digital content with analog trimming or data storage into next generation deployments, such as 5G New Radio (NR). A key benefit of using Attopsemi I-fuse OTP memory on the XR013 RF platform is the flexibility with which RF products can address different regional market requirements via a single chip design (as different configurations can be stored). This will lead to project development cost savings, as well as facilitating inventory management.

Shine Chung, Chairman of Attopsemi, stated that they are very excited about the prospect of their I-fuse™ IP now being qualified for incorporation into the X-FAB XR013 process. They are very pleased that their OTP was chosen by X-FAB’s customers for 5G applications. Thanks to the high reliability, high quality and fully testable IP, our I-fuse™ has been proven to meet X-FAB’s stringent demands in their advanced processes.

Dr. Greg U’Ren, Director of RF Technology at X-FAB, said that close collaboration with Attopsemi has created a cost-effective OTP memory solution for the customers using XR013. This will be pivotal in enabling their customers to increase the on-chip functionality, giving them a strong foundation for further innovation, and allowing the requirements of different geographic locations to be attended to.

The qualified Attopsemi I-fuse OTP solution is available for clients from X-FAB’s customer portal “My X-FAB”.

Click here to contact X-FAB for more information.

Publisher: everything RF
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