Rapidtek Exhibits its Next-Generation RF Test Solutions at IMS 2023

Rapidtek Exhibits its Next-Generation RF Test Solutions at IMS 2023

Rapidtek Technologies was participating in the IEEE MTT-S International Microwave Symposium (IMS) 2023 at Booth No. 2249 from June 13th through June 15th in San Diego, CA. During the three-day event, Rapidtek conducted live joint demonstrations of next-generation RF test solutions, ideal for various applications, including RF, space, and satellite.

Rapidtek's innovative solution involved generating a Sub-6G baseband signal using the AMARI Callbox and the jointly developed up-down converter (UDC) system, which enables the generation of mmWave communication test frequency bands ranging from 6GHz to 48GHz. It supports testing in frequency bands such as Ku Band, Ka Band, and n257~n262 while offering advanced signaling control. The solution has completed numerous 3GPP standard communication test verifications, including WiFi 6E/7, 5G FR2, and B5G.

Rapidtek also showcases passive solutions and products in collaboration with its strategic partner, Unictron Technologies Corporation. Unictron Technologies Corporation is a leading provider of antennas, antenna modules, and piezoelectric ceramic elements, widely used in various applications such as automobile parking sensors, weaving machine actuators, ultrasonic nebulizers, ultrasonic sensors, and a wide range of ultrasonic transducers.

"We are pleased to have Unictron Technologies Corporation, Rohde & Schwarz, Amarisoft, Paralink Networks Inc., and ALifecom Technology Corporation join us in showcasing the innovative test solution with Rapidtek's UDC Modules and accessories," said Arthur Wang, founder and CEO of Rapidtek. This test solution provides customers with a customized test methodology for the next generation of seamlessly connected life, catering to diverse band requirements.

In addition, Rapidtek presented its cutting-edge Active Electrical Scan Array (AESA) designs and RF testing solutions, including phased array antennas, communication payloads, and up-down converters. These solutions offer reliable, high-performance connectivity for many Low Earth Orbit (LEO) satellite applications.

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Publisher: everything RF