StratEdge Corporation, a company for the design, production, and assembly of high-frequency and high-power semiconductor packages for RF, microwave, and millimeter-wave devices, has announced its capability for making hybrid packages used in legacy applications where redesigns are difficult or impossible. These hybrid packages, often developed decades ago, are still vital in many critical defense applications.
StratEdge excels at glass-to-metal, ceramic-to-metal, and metal-to-metal sealing technologies necessary for the production of large metal housing with hermetic feedthroughs. Similar to its molded ceramic packages, ASTM F15 alloy is a key component used in constructing hybrid packages. StratEdge possesses numerous furnaces with various gas atmospheres that are required for glass sealing and brazing or soldering components of various compositions including metalized ceramic, iron alloys, copper, copper composites, and copper laminates.
“StratEdge has the unique equipment and expertise required to build these types of packages,” says Casey Krawiec, VP of Global Sales for StratEdge. Krawiec further explained, “Our processes for manufacturing molded ceramic packages share many similarities with the requirements for building legacy hybrid packages used in military and space applications.”
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