STMicroelectronics brought next-generation satellite navigation to drivers with the launch of enhanced, always-available, always-accurate 3D positioning on its TESEO III automotive-navigation ICs. The new TESEO DRAW firmware for ST’s multi-constellation positioning chips enables navigation devices to provide continuous, accurate location and turn-by-turn instructions even when satellite signals are poor or unavailable, such as in tunnels, covered car parks, or multi-level highways. TESEO DRAW also enhances performance in built-up areas, such as in urban canyons, where conventional navigation systems can lose accuracy.
TESEO DRAW merges the satellite information with data from vehicle sensors such as the gyroscope, accelerometer, and wheel-speed sensors, to calculate location accurately in three dimensions including elevation. If the satellite signal is poor, TESEO DRAW compensates for the loss of accuracy, and if the signal becomes unavailable, navigation continues uninterrupted based on calculated location (dead reckoning). Road tests carried out by ST in difficult under-cover and urban environments have demonstrated continuous tracking from entry to exit in complex multi-level car parks, and at street level between tall buildings, where conventional systems have been unable to track the vehicle.
GNSS has revolutionized activities such as commercial logistics, asset management, and personal mobility. Over four billion GNSS devices are now in use worldwide. By enabling high-accuracy 3D dead reckoning, TESEO DRAW expands the opportunities for developers to commercialize new applications. This can provide significant improvements in existing services such as fleet tracking, eCall, or ERA-GLONASS emergency response, usage-based insurance, road tolling, and anti-theft systems.
The TESEO DRAW firmware has multiple modes and is capable of referring to sensors on the vehicle’s CAN bus or discrete sensors such as the odometer, reverse sensor, MEMS accelerometer and gyroscope, or MEMS inertial module connected to the TESEO III IC. ST can now provide a unified platform comprising navigation engines, 3D positioning capability, and motion sensors.
TESEO III ICs loaded with the new TESEO DRAW firmware are sampling now, and will enter mass production in Q1 2016.
