Vishay Intertechnology has announced its technology lineup that will be on display at the 2016 IEEE MTT International Microwave Symposium (IMS2016) from May 22 to 27 at Moscone Center in San Francisco. In booth 722, the company will be highlighting their latest cutting-edge high-frequency multilayer ceramic chip capacitors (MLCCs), surface-mount and wire-bondable thin film products, and custom substrates.
Manufactured in noble metal electrode (NME) technology with a wet build process, their high-frequency MLCCs feature Q > 2000, ultra-low ESR, and tight capacitance tolerance down to ± 0.05 pF, and they are available with lead (Pb)-free, lead (Pb)-bearing, and non-magnetic copper terminations. QUAD high-power devices in the 0505, 1111, 2525, and 3838 case sizes will also be on display. These MLCCs are optimized for a wide range of high-frequency RF applications, including MRI coils and generators, RF instrumentation, and impedance matching networks.
These MLCCs in the 0402, 0603, and 0805 case sizes, offers an extended operating temperature range from -55 °C to +200 °C and an ultra-stable dielectric material with an excellent aging rate of 0 % per decade. They are designed to reduce signal loss and energy consumption in applications such as VoIP networks, cellular base stations, and satellite, Wi-Fi (802.11), and WiMAX (802.16) wireless communication.
Vishay Intertechnology will also be highlighting a wide range of precision thin film resistor chips and networks, including devices with high-frequency performance to 40 GHz; high power ratings to 6 W; low TCR of 25 ppm/°C; and tolerances of 0.1 %. They will also feature thin film tantalum nitride microwave resistors in the 0402 and 0201 case sizes. Featuring an alumina substrate, resistance ranges from 20 O to 20 kO, and microwave resistance ranges from 20 O to 1 kO, these devices are ideal for amplifiers, oscillators, attenuators, and couplers. In addition, wire-bondable thin film 50 Ohm micro-strip transmission lines will be on display for test and measurement applications, high-frequency hybrid assemblies, and RF bread-boarding.
They will also show custom substrates with sidewall patterning. Ideal for high-frequency circuits in RF applications and high-bit-rate transceivers, these substrates feature a plate thickness up to 0.050 in. and minimum line and width gap of 0.003 in. with a tolerance down to ± 0.001 in., and they are available in a variety of metal systems.
