Silex Technology, a developer of wired and wireless networking solutions has introduced a new embedded Wi-Fi solution, the SX-SDPAC SDIO System-in-Package (SiP). This dual-band 1x1 802.11a/b/g/n/ac plus Bluetooth 4.1+HS "Smart Ready" SiP is based on the latest Qualcomm Atheros QCA9377 System-on-Chip (SoC). It offers a cost effective, small form factor, and low power Wi-Fi + BT connectivity solution for customers.
With the release of the SX-SDPAC SiP, Silex expands its 802.11ac SDIO portfolio. This SiP is ideal for high-volume customers who want to achieve the lowest bill of material (BOM) cost and the smallest footprint. It can be mounted directly on the device printed circuit board assembly, which minimizes cost by eliminating extra materials and labor associated with a radio module or card. It's small size, light weight and low power consumption makes it a viable option not only for handheld devices but also for a wide variety of applications such headsets, speakers, displays and many other Internet of Things (IoT) applications.
SX-SDPAC's compact single-stream design lowers cost while delivering dramatic speed, power and performance improvements, empowering users to effortlessly stream HD-quality videos and watch rich multimedia anywhere they have Wi-Fi coverage.
Key Features of the SX-SDPAC
- Based on Qualcomm Atheros QCA9377 Chipset
- 802.11 a/b/g/n/ac Wave 2 MU-MIMO
- SDIO 3.0 WLAN Host Interface
- Bluetooth 4.2 BR/EDR/LE Smart Ready
- Commercial Temperature, -20°C ~ +70°C
- Optional Antenna Diversity Support
- Internal 48 MHz XTAL
- Single-Ended Integrated RF Front-End Design
- Minimal Host Utilization (11ac speeds) via Offloading
- Small Size Package of 6.9 mm x 6.9 mm x 1.082 mm
To expedite the product development process, Silex is also providing additional world-class engineering services including custom driver development, certification services and hardware schematic design reviews. The product is in full production and is now available for purchase at Silex distribution partners. Click here for more information.