Nano Dimension & Harris Collaborate on 3D-Printed Electronic Modules for Space Applications

Nano Dimension Technologies, a developer of 3D printed electronics, has received a grant from the Israel Innovation Authority, to finance a project to develop 3D printing of electronic modules for space applications.

The total approved budget for this project is approximately $87,000 (NIS 309,000), of which the Israel Innovation Authority will finance 50%. According to the terms of the grant, Nano Dimension will pay royalties on future sales up to the full grant amount.

The unique project will be completed in collaboration with Harris Corporation. Nano Dimension and Harris have entered into a non-binding letter of intent with respect to the collaboration. The project will demonstrate, for the first time, the manufacturing of 3D printed double sided, multilayer circuits that distribute digital, power and RF signals using the same substrate, thus providing reduced size, weight, power and cost of space systems. New high volume printed RF technology will provide improved reliability and uniformity of space systems by eliminating manual assembly.

Publisher: everything RF
Tags:-   Space Qualified