Brook Sandy-Smith, the Technical Support Engineer for PCB Assembly Materials at Indium Corporation will be presenting at the Electronic Design Innovation Conference (EDI CON) and Exhibition 2017 from September 11 - 13 in Boston, Mass.
The presentation will be “Overcoming Assembly Challenges with Bottom Termination Components (BTCs).” The presentation will review the updated recommendations for design and implementation of BTCs, including major changes made to IPC-7093. Sandy-Smith will also share strategies to minimize voiding and ensure robust BTC assemblies.
Sandy-Smith is a Technical Support Engineer specializing in printed circuit board assembly materials, particularly solder paste. She conducts application testing and qualifications for new product introductions. She earned degrees in chemical engineering (with a focus on materials) and German language from the University of Rhode Island.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
