Mercury Systems, announced that they have received a $3.8 million order from a leading defense prime contractor for multi-chip module devices, integrated into an advanced airborne electronic warfare system. The order was booked in the Company’s fiscal 2018 second quarter and is expected to be shipped over the next several quarters.
Mercury’s broad portfolio of secure digital microelectronic solutions are designed and manufactured exclusively in the Company’s Defense Microelectronics Activity (DMEA)-trusted Advanced Microelectronics Center in Phoenix, Ariz. The company’s three-dimensional packaging technology delivers maximum space-savings in a highly ruggedized ball grid array (BGA) package designed for harsh military environments.
Defense prime contractors and the military forces can count on Mercury’s next-generation business model for long-term supply continuity of the most affordable, compact and high-performance microelectronics solutions.
