Texas Instruments Incorporated (TI) announced that its Bluetooth® v4.0 technology based CC2560 and CC2564 wireless devices are now available in easy-to-integrate QFN packages offered by TI and its distribution partners. TI also announced the availability of additional production-ready modules based on the two devices, as well as software and tools. The QFN packages and various modules give customers choice regarding power, size and cost requirements.
QFN packages and kits-
The ROHS-compliant QFN packages of the CC2560 and CC2564 Bluetooth v4.0 devices are available today through TI and its distributors. To further help design efforts, TI encourages customers to download from its wiki a two-layer reference design (schematics, layout and bill of materials) that can be copied and pasted into end applications. TI will release full-featured evaluation boards and design materials for hardware and software prototyping with the CC2560 and CC2564 QFN devices later this quarter.
Production-ready modules and kits-
In addition to the two modules previously announced, four new complete, validated and certified modules are now available from TI partners. The modules vary in size, temperature range and output power—including Class 1 and Class 2 versions. One module also offers a pre-integrated MCU plus CC2564 solution for faster development. Software development kits for Bluetooth and Bluetooth/Bluetooth low energy solutions are currently available. Customers can also access sample applications and demos provided in source code showing API usage.
Software for QFN devices and modules-
A royalty-free Bluetooth stack and various profiles are provided pre-integrated on MCUs such as TI's ultra-low power MSP430™ MCU and Stellaris® ARM® Cortex™-M3/M4 MCUs. TI will also release an updated Bluetooth stack in mid-4Q 2012. The new stack will offer flexible software build options that will enable customers to select specific profiles to support. This capability allows for greater memory size optimization and the ability to support a broader range of MCUs.
Features and benefits of the CC2560 and CC2564 portfolio-
The CC2560 device offers Bluetooth v4.0 "classic" support for audio and data applications requiring high throughput. The CC2564 device supports two options: dual-mode Bluetooth/Bluetooth low energy or dual-mode Bluetooth/ANT+. Applications that benefit from the dual-mode solution include those that require wireless communication to Bluetooth "classic" products and Bluetooth low energy or ANT+ devices such as sports and fitness aggregator gadgets or smart watches. The dual-mode Bluetooth v4.0 solution can also be used as a sensor solution that delivers longer range to communicate with mobile devices that may or may not have Bluetooth low energy technology.
| Features | Benefits |
- Bluetooth v4.0 support (Bluetooth and Bluetooth low energy dual-mode)
- Best-in-class Bluetooth RF performance
- TI's proven 7th generation Bluetooth technology
| - 2x range over competitive Bluetooth low energy solutions
- Robust, high throughput wireless connecitivity with extended range and power efficiency
|
- Royalty-free Bluetooth software stack offered from TI and developed by Stonestreet One
- Supports various microcontrollers such as TI's MSP430 and Stellaris MCUs
| - Simplified and minimized hardware and software development for quick time-to-market
- Allows for extensive application prototyping and development
|
Availability and pricing-
The QFN solutions are available today on the TI eStore and through authorized TI distributors:
| Device | Part | Size | Price |
| CC2560 (QFN) | CC2560ARVMR CC2560ARVMT | Device: 7.83 x 8.10 mm Design: 16.5x16.5 mm | $1.86 for 1K units |
| CC2564 (QFN) | CC2564ARVMR CC2564ARVMT | Device: 7.83 x 8.10 mm Design: 16.5x16.5 mm | $2.14 for 1K units |
For more information please visit http://www.ti.com.
