StratEdge Corporation, a leader in high-performance semiconductor packages will feature its new line of packages that meet the extreme demands of GaN and GaAs devices at IMS 2018. StratEdge packages meet the critical requirements of the telecom, mixed signal, VSAT, broadband wireless, satellite, military, test and measurement, automotive, down-hole, and MEMS markets.
The company will showcase its complete line of post-fired and molded ceramic semiconductor packages operating from DC to 63+ GHz. These packages have electrical transition designs that ensure exceptionally low electrical losses and operate efficiently, even at the highest frequencies. All packages are lead-free and most meet RoHS and WEEE standards. In addition, StratEdge offers complete automated assembly and test services for these packages, including gold-tin solder die attach.
StratEdge will be exhibiting in booth 1649, at IMS 2018 which is being held in Philadelphia, USA from June 11- 15.
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