DuPont Electronics & Imaging and the SCHMID Group have entered into a nonexclusive joint development agreement to explore new PCB plating applications to bring advanced innovations to their global customers. The partnership will benefit high-end printed circuit board manufacturers by delivering next-generation interconnect products and metallization processes that can create faster, smarter and more reliable devices for the 5G era. The new solutions which will include equipment and chemistry are expected to be launched in late 2020.
SCHMID and DuPont’s combined expertise in equipment and chemistry respectively delivers the need for innovations in areas like 5G, automotive, and artificial intelligence. Avi Avula, the Global Business Director of DuPont Electronics & Imaging said that SCHMID is an outstanding partner with extensive engineering expertise, process knowledge, and world-class metallization equipment. Coupled with DuPont’s broad offerings including metallization chemistry, flexible copper-clad laminates, and dry film imaging films, strong customer relationships, and global footprint, this partnership will enable their company to advance metallization solutions for leading-edge PCB and substrate applications.
President & CEO of SCHMID Group, Christian Schmid stated that partnering with DuPont will allow them to introduce disruptive innovations to their customers in the advanced electronics manufacturing market. They are committed to launching advanced metallization systems that will address the challenges that their customers face meeting the required performance and reliability. They are confident that the possibilities enabled with this partnership will significantly contribute to the realization of this joint target - delivering better solutions to create superior value.
The new equipment and chemistry solutions are expected to address the challenges from advanced circuit board designs that require enhanced performance and reliability, and improved cost of ownership for production.
