c04-21468

Note : Your request will be directed to Microchip Technology.

c04-21468 Image

The c04-21468 from Microchip Technology is a RF Package with Terminal Count 896, Lead Pitch 1 mm, Package Thickness 4.03 mm. Tags: CLGA. More details for c04-21468 can be seen below.

Product Specifications

Product Details

  • Part Number
    c04-21468
  • Manufacturer
    Microchip Technology
  • Description
    896-Terminal Ceramic Land Grid Array

General Parameters

  • Terminal Count
    896
  • Lead Pitch
    1 mm
  • Mounting
    Surface Mount
  • Package Size
    31 x 31 x 4.03 mm
  • Package Thickness
    4.03 mm
  • Type
    CLGA

Technical Documents

Latest RF Packages

View more products