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RF Packages - Page 17

570 RF Packages from 9 Manufacturers meet your specification.
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LCC04439 Image
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Spectrum Semiconductor Materials - LCC04439

RF Package from Spectrum Semiconductor Materials
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Description:Ceramic, LCC Surface Mount 44 Lead RF Package
Type:
LCC
Cavity Size:
0.29 x 0.45 Inches (L x W)
Terminal Count:
44
Mounting:
Surface Mount
Package Size:
0.825 x 0.45 Inches (L x W)
Terminal Type:
Lead
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8L-MSOP-65P Image
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QP Technologies - 8L-MSOP-65P

RF Package from QP Technologies
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Description:MSOP Surface Mount 8 Lead RF Package
Type:
MSOP
Cavity Size:
72 × 98 mils
Terminal Count:
8
Mounting:
Surface Mount
Package Size:
3 mm
Terminal Type:
Lead
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C04-25157 Image
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Microchip Technology - C04-25157

RF Package from Microchip Technology
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Description:592-Ball Standard Ball Grid Array Package
Type:
BGA
Terminal Count:
592
Mounting:
Surface Mount
Package Thickness:
0.60 mm
Package Size:
27 x 27 x 2.24 mm
Terminal Type:
Ball
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Ampleon - SOT1130A

RF Package from Ampleon
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Description:Air-Cavity Ceramic (ACC) Flange Mount 4 Lead RF Package
Type:
ACC
Terminal Count:
4
Mounting:
Flange Mount
Package Size:
17.12 x 20.45 x 4.65 mm (W x L x T)
Terminal Type:
Lead
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KD-80177-E Image
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KYOCERA - KD-80177-E

RF Package from KYOCERA
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Description:48 Lead C-DIP(Ceramic Dual Inline Package)
Type:
C-DIP
Cavity Size:
6.35 x 6.35 mm
Terminal Count:
48
Mounting:
Through Hole
Package Size:
60.96 x 15.49 mm(C x D)
Terminal Type:
Lead
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8L-SOIC-150W-127P Image
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QP Technologies - 8L-SOIC-150W-127P

RF Package from QP Technologies
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Description:SOIC Surface Mount 8 Lead RF Package
Type:
SOIC
Cavity Size:
95 x 150 mils
Terminal Count:
8
Mounting:
Surface Mount
Package Size:
0.150 Inches (Wide)
Terminal Type:
Lead
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C04-011 Image
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Microchip Technology - C04-011

RF Package from Microchip Technology
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Description:3-Lead Plastic (EK) [DDPAK]
Type:
DDPAK
Cavity Size:
0.067 x 0.045, 0.065 Inches (L x T)
Terminal Count:
3
Mounting:
Surface Mount
Package Size:
0.420 x 0.380 x 0.19 Inches
Terminal Type:
Lead
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Ampleon - SOT1130B

RF Package from Ampleon
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Description:Air-Cavity Ceramic (ACC) Flange Mount 4 Lead RF Package
Type:
ACC
Terminal Count:
4
Mounting:
Flange Mount
Package Size:
17.12 x 9.91 x 4.65 mm (W x L x T)
Terminal Type:
Lead
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KD-80292 Image
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KYOCERA - KD-80292

RF Package from KYOCERA
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Description:14 Lead C-DIP(Ceramic Dual Inline Package)
Type:
C-DIP
Cavity Size:
5.59 x 3.96 mm
Terminal Count:
14
Mounting:
Through Hole
Package Size:
17.78 x 7.87 mm (C x D)
Terminal Type:
Lead
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LCC04442 Image
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Spectrum Semiconductor Materials - LCC04442

RF Package from Spectrum Semiconductor Materials
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Description:Ceramic, LCC Surface Mount 44 Lead RF Package
Type:
LCC
Cavity Size:
0.474 x 0.474 Inches (L x W)
Terminal Count:
44
Mounting:
Surface Mount
Package Size:
0.65 x 0.65 Inches (L x W)
Terminal Type:
Lead
more info
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