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RF Packages - Page 14

570 RF Packages from 9 Manufacturers meet your specification.
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C04-25172 Image
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Microchip Technology - C04-25172

RF Package from Microchip Technology
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Description:780-Ball Plastic Ball Grid Array Package
Type:
BGA
Terminal Count:
780
Mounting:
Surface Mount
Package Thickness:
0.58 mm
Package Size:
29 x 29 x 2.21 mm
Terminal Type:
Ball
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QFN-8848-0520 Image
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Barry Industries - QFN-8848-0520

RF Package from Barry Industries
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Description:48 Pin HTCC Air Cavity QFN Package from DC to 40 GHz
Type:
QFN, HTCC
Insertion Loss:
0.5 to 4 dB
Terminal Count:
48
Mounting:
Surface Mount
Package Material:
Alumina (Al2O3)
Package Thickness:
0.95 mm
Package Size:
8 x 8 mm
Terminal Type:
Pin
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SOT634A Image
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Ampleon - SOT634A

RF Package from Ampleon
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Description:Air-Cavity Ceramic (ACC) Flange Mount 2 Lead RF Package
Type:
ACC
Terminal Count:
2
Mounting:
Flange Mount
Package Size:
34.16 x 13.84 x 4.83 mm (U1 x U2)
Terminal Type:
Lead
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KD-P85311-A Image
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KYOCERA - KD-P85311-A

RF Package from KYOCERA
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Description:84 Pin C-PGA (Ceramic Pin Grid Array Package)
Type:
C-PGA
Cavity Size:
11.94 x 11.94 mm (A x B)
Terminal Count:
84
Mounting:
Surface Mount
Package Size:
27.94 x 27.94 mm (C x D)
Terminal Type:
Pin
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StratEdge - G3725M-1

RF Package from StratEdge
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Description:Flatpack Surface Mount RF Package
Type:
Flatpack
Mounting:
Surface Mount
Package Material:
Glass
Package Size:
1.020 x 0.585 Inches (L x W)
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CQJ03208 Image
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Spectrum Semiconductor Materials - CQJ03208

RF Package from Spectrum Semiconductor Materials
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Description:Ceramic Surface Mount 32 Lead RF Package
Type:
CQFP
Cavity Size:
0.225 x 0.29 Inches (L x W)
Terminal Count:
32
Mounting:
Surface Mount
Package Size:
0.55 x 0.45 Inches (L x W)
Terminal Type:
Lead
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40L-PDIP-600 Image
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QP Technologies - 40L-PDIP-600

RF Package from QP Technologies
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Description:PDIP Surface Mount 40 Lead RF Package
Type:
PDIP
Cavity Size:
260 x 266 mils
Terminal Count:
40
Mounting:
Surface Mount
Package Size:
0.600 Inches (Wide)
Terminal Type:
Lead
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C04-25139 Image
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Microchip Technology - C04-25139

RF Package from Microchip Technology
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Description:480-Ball [Standard] Ball Grid Array
Type:
BGA
Terminal Count:
480
Mounting:
Surface Mount
Package Thickness:
0.60 mm
Package Size:
23 x 23 x 2.24 mm
Terminal Type:
Ball
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QFN-8848-0521 Image
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Barry Industries - QFN-8848-0521

RF Package from Barry Industries
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Description:48 Pin HTCC Air Cavity QFN Package from DC to 40 GHz
Type:
QFN, HTCC
Insertion Loss:
0.5 to 4 dB
Terminal Count:
48
Mounting:
Surface Mount
Package Material:
Alumina (Al2O3)
Package Thickness:
0.95 mm
Package Size:
8 x 8 mm
Terminal Type:
Pin
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Ampleon - SOT957A

RF Package from Ampleon
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Description:Air-Cavity Ceramic (ACC) Flange Mount 2 Lead RF Package
Type:
ACC
Terminal Count:
2
Mounting:
Flange Mount
Package Size:
19.94 x 34.16 x 4.67 mm (W x L x T)
Terminal Type:
Lead
more info
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