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RF Packages - Page 18

570 RF Packages from 9 Manufacturers meet your specification.
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QP-QFN100-12MM-.4MM Image
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QP Technologies - QP-QFN100-12MM-.4MM

RF Package from QP Technologies
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Description:OmPP, QFN, Cavity Surface Mount 100 Lead RF Package
Type:
OmPP, QFN
Terminal Count:
100
Mounting:
Surface Mount
Package Material:
Semiconductor Molding Epoxy
Package Thickness:
0.800 mm
Package Size:
12 mm
Terminal Type:
Lead
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C04-002 Image
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Microchip Technology - C04-002

RF Package from Microchip Technology
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Description:14-Lead Ceramic DIP Dual In-Line
Type:
C-DIP
Terminal Count:
14
Mounting:
Drop-In
Package Size:
0.300 Inches
Terminal Type:
Lead
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SOT1135A Image
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Ampleon - SOT1135A

RF Package from Ampleon
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Description:ACC Flange Mount 2 Lead RF Package
Type:
ACP
Terminal Count:
2
Mounting:
Surface Mount
Package Size:
19.94 x 20.45 x 4.65 mm (W x L x T)
Terminal Type:
Lead
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KD-81533-F Image
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KYOCERA - KD-81533-F

RF Package from KYOCERA
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Description:28 Lead C-DIP(Ceramic Dual Inline Package)
Type:
C-DIP
Cavity Size:
7.87 x 7.87 mm
Terminal Count:
28
Mounting:
Through Hole
Package Size:
35.56 x 15.49 mm (C x D)
Terminal Type:
Lead
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LCC04443 Image
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Spectrum Semiconductor Materials - LCC04443

RF Package from Spectrum Semiconductor Materials
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Description:Ceramic, LCC Surface Mount 44 Lead RF Package
Type:
LCC
Cavity Size:
0.3 x 0.3 Inches (L x W)
Terminal Count:
44
Mounting:
Surface Mount
Package Size:
0.65 x 0.65 Inches (L x W)
Terminal Type:
Lead
more info
QP-QFN12-3MM-.5MM Image
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QP Technologies - QP-QFN12-3MM-.5MM

RF Package from QP Technologies
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Description:OmPP, QFN, Cavity Surface Mount 12 Lead RF Package
Type:
OmPP, QFN
Terminal Count:
12
Mounting:
Surface Mount
Package Material:
Semiconductor Molding Epoxy
Package Thickness:
0.800 mm
Package Size:
3 mm Wide
Terminal Type:
Lead
more info
C04-010 Image
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Microchip Technology - C04-010

RF Package from Microchip Technology
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Description:18-Lead Ceramic Dual In-Line
Type:
C-DIP
Terminal Count:
18
Mounting:
Drop-In
Package Size:
0.300 Inches
Terminal Type:
Lead
more info
SOT1135B Image
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Ampleon - SOT1135B

RF Package from Ampleon
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Description:ACC Flange Mount 2 Lead RF Package
Type:
ACP
Terminal Count:
2
Mounting:
Surface Mount
Package Size:
19.94 x 9.91 x 4.65 mm (W x L x T)
Terminal Type:
Lead
more info
KD-82235 Image
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KYOCERA - KD-82235

RF Package from KYOCERA
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Description:22 Lead C-DIP(Ceramic Dual Inline Package)
Type:
C-DIP
Cavity Size:
6.35 x 5.59 mm
Terminal Count:
22
Mounting:
Through Hole
Package Size:
27.43 x 10.41 mm (C x D)
Terminal Type:
Lead
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LCC04805 Image
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Spectrum Semiconductor Materials - LCC04805

RF Package from Spectrum Semiconductor Materials
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Description:Ceramic, LCC Surface Mount 48 Lead RF Package
Type:
LCC
Cavity Size:
0.344 x 0.35 Inches (L x W)
Terminal Count:
48
Mounting:
Surface Mount
Package Size:
0.56 x 0.56 Inches (L x W)
Terminal Type:
Lead
more info
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