RF PIN Diodes - Page 17

286 RF PIN Diodes from 9 Manufacturers meet your specification.
BAP50-03 Image
Description:General purpose PIN diode with 50 mA of forward current
Configuration:
Single Diode
No. of Diodes:
1
Forward Voltage:
0.95 to 1.1 V
Forward Current:
50 mA
Reverse Voltage:
50 V
Reverse Current:
0.1 uA
Capacitance:
0.2 to 0.55 pF
Power Dissipation:
500 mW
Package Type:
Surface Mount
more info
Description:Silicon PIN Diode with 100 mA of forward current
Configuration:
Common Cathode
Frequency:
1 MHz to 6 GHz
No. of Diodes:
2
Forward Voltage:
1.1 V
Forward Current:
100 mA
Reverse Voltage:
150 V
Capacitance:
0.13 to 0.35 pF
Power Dissipation:
250 mW
Package Type:
Flatpack
more info
Description:0.30 pF Fast Switching Low Power Pin Diode
Reverse Voltage:
200 V
Capacitance:
0.30 pF
Package Type:
Chip
more info
Description:Silicon PIN Diode Bondable Chips Silicon PIN Diode Bondable Chips Devices with 200 mA of forward current
Configuration:
Single Diode
Frequency:
100 MHz to 30 GHz
No. of Diodes:
1
Forward Current:
200 mA
Reverse Voltage:
50 V
Reverse Current:
10 uA
Capacitance:
0.2 to 0.25 pF
Package Type:
Chip
more info
Description:Common Cathode PIN Diode from 100 MHz to 12 GHz
Configuration:
Common Cathode
Reverse Current:
10 uA
Package Type:
Chip
more info
BAP70-03 Image
Description:Silicon PIN diode with 100 mA of forward current
Configuration:
Single Diode
No. of Diodes:
1
Forward Voltage:
0.9 to 1.1 V
Forward Current:
100 mA
Reverse Voltage:
50 V
Reverse Current:
0.1 uA
Capacitance:
200 to 570 pF
Power Dissipation:
500 mW
Package Type:
Surface Mount
more info
Description:Silicon PIN Diodes with 100 mA of forward current
Configuration:
Single Diode
Frequency:
10 MHz to 6 GHz
No. of Diodes:
1
Forward Voltage:
0.95 to 1.1 V
Forward Current:
100 mA
Reverse Voltage:
50 V
Reverse Current:
0.05 uA
Capacitance:
0.1 to 0.5 pF
Power Dissipation:
250 mW
Package Type:
Flatpack
more info
Description:0.03 pF Medium Power General Purpose Pin Diode
Reverse Voltage:
200 V
Capacitance:
0.03 pF
Package Type:
Chip
more info
Description:Silicon PIN Diode Bondable Chips Silicon PIN Diode Bondable Chips Devices with 200 mA of forward current
Configuration:
Single Diode
Frequency:
100 MHz to 30 GHz
No. of Diodes:
1
Forward Current:
200 mA
Reverse Voltage:
100 V
Reverse Current:
10 uA
Capacitance:
0.1 to 0.15 pF
Package Type:
Chip
more info
Description:Silicon Dioxide Passivated Chip PIN Diode
Forward Current:
10 to 200 mA
Reverse Current:
10 uA to 200 mA
Capacitance:
0.15 pF
Package Type:
Chip
more info

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