Glass-based, 3D RF Device Innovator Secures Funding from Lockheed Martin
3D Glass Solutions (3DGS), a leading innovator of glass-based, three-dimensional passive RF devices, has secured an investment from aerospace and global security leader Lockheed Martin, as part of its Series B funding.
3D Glass Solutions produces a wide variety of glass-based system-in-package (SiP) devices and components using its patented low-loss photosensitive APEX® Glass technology for applications in radio-frequency (RF) electronics, photonics, automotive radar, integrated circuit (IC) electronics, medical, aerospace, defense, wireless infrastructure, mobile handset, and Internet of Things (IOT) industries. They provide their customers complete glass-enabled systems integration services. Their aim is to provide our customers with an integrative solution in RF electronics and IC packaging that allows them to integrate more components onto a single platform while decreasing overall manufacturing costs. Click here to read more.