StratEdge Expands Production Capacity of its RF Packaging Line for 5G Infrastructure
StratEdge Corporation, a leader in design, production and assembly services for high-frequency and high-power semiconductor packages, announced the expansion of its production line for producing ceramic and molded ceramic packages to support 5G infrastructure demands. The packages, usually used to protect high-power laterally-diffused metal-oxide semiconductor (LDMOS), gallium arsenide (GaAs), silicon carbide (SiC), and gallium nitride (GaN) devices, match standard outlines developed to support cellular base stations. Run rates in excess of 100,000 packages are being accommodated.
GaN-on-SiC devices are frequently used in 5G base stations, but these devices can have extremely high-power densities, which generate a tremendous amount of localized heat. StratEdge packages use copper-molybdenum-copper (CMC) bases to dissipate this heat, increasing the power output the chip achieves and enabling the device to operate at cooler temperatures so it lasts longer, has higher reliability, and performs more efficiently. Click here to read more.