There are many applications in RF design where it is necessary to absorb large amounts of RF power. In order to effectively absorb large amounts of power, resistors and terminations must be constructed on materials that have a high coefficient of thermal conductivity.
Commonly used substrates for high power resistors and terminations are Beryllia, Aluminum Nitride, and to a lesser extent, Boron Nitride and Silicon Carbide. While these materials are known for their superior thermal properties, none of them come even close to matching the thermal conductivity of CVD Diamond.
Please note:
By downloading a white paper, the details of your profile might be shared with the creator of the content and you may be contacted by them directly.
