As the volume of information explodes with the widespread use of the Internet of Things (IoT), 5G networks, advanced driver-assistance systems (ADAS), and generative artificial intelligence (AI), information processing devices for data centers and terminals require the capability to transmit information more quickly in larger volumes and wider bandwidths. Accordingly, the demand for more finely pitched, highly integrated and densely packed semiconductor chips is rising, while package substrates require larger areas and narrower pitches for pitch connections to facilitate the mounting of multiple devices, and even to accommodate future 2.xD to 3D packages.
This article examines the latest trends in core materials supporting next-generation semiconductor packages and substrates, and introduces Resonac’s newest low-warpage, low CTE (coefficient of thermal expansion), and high elastic modulus core material MCL-E-795G and TYPE-F technology for high thickness accuracy.
