Indium Corporation will feature the Durafuse LT, its innovative high-reliability, low-temperature alloy system, during the virtual IPC APEX Expo that will be held from 8th - 12th March, 2021.
Durafuse LT is a novel, low-temperature alloy system designed to provide high-reliability in low-temperature applications that need to reflow below 210°C. Where traditional low-temperature solders can produce brittle solder joints that are susceptible to drop shock failures, Durafuse LT provides superior drop shock resilience, outclassing BiSn or BiSnAg alloys, and performing better than SAC305 with optimum process setup.
Unique features of the Durafuse LT include:
- Provides a solution for heat-sensitive components and flex polymers
- Prevents thermal warpage of processor components and multilayer boards
- Meets low-temperature requirements for step soldering, particularly in RF shield attachment, post underfill processes and rework applications
Click here for more information about Durafuse LT.
