MixComm, based in Chatham, N.J., is a fabless semiconductor company developing transformative solutions for the emerging wireless applications and markets. MixComm was co-founded in 2017 by Dr. Harish Krishnaswamy of Columbia University’s Engineering School and Frank Lane, formerly Senior Director at Flarion Technologies and Vice-President of Technology for Qualcomm. The founding team has a proven track record in RFIC research and development and in commercializing cutting-edge RF silicon at both startup and large semiconductor companies. MixComm is took part in the Virtual IMS 2020 event and showcased its beamforming front end IC in its booth.
SUMMIT2629 5G 28 GHz Beamforming Front End IC
The SUMMIT 2629, an eight-channel RF front-end for 28 GHz, 5G phased array antenna systems fabricated in RF-SOI. The SUMMIT 2629 was designed to address the challenges constraining 5G mmWave performance by:
- Extending the link range to decrease infrastructure costs and improve customer satisfaction.
- Reducing power consumption and thermal dissipation.
- Reducing antenna array complexity and overall RF front-end cost.
Operating from 26.5 to 29.5 GHz, the SUMMIT 2629 RFIC integrates power amplifiers (PA), low noise amplifiers, T/R switching, beamformers with beam table memory, calibration, gain control and temperature and power telemetry with a high-speed system peripheral interface (SPI) for control. A single SUMMIT 2629 provides two sets of four channels for two antenna polarizations – a total of eight channels per RFIC.
Features of this product:
- Four-element Dual-pol. TX/RX with Independent Polarization Beam Directions.
- High-Power, High-Efficiency SOI CMOS Power Amplifiers.
- State-of-the-art Low-Noise Amplifiers and Low-Loss T/R Switching.
- Ultra-low Transmit and Receive-Mode Power Consumption.
- 6-bit full-360o Phase Shifting and 0.5dB-step 16dB-range Variable Gain in Each Path.
- Fully calibrated for Gain/Phase Matching Across IC’s.
- Extensive On-chip Temperature and Power Sensing.
- On-chip Gain Control for Temperature Compensation.
- High-Speed SPI with Large On-Chip Beam Table Storage.
- Wafer-Level Chip-Scale Package (WLCSP) compatible with low-cost PCB manufacturing.
- Support for Large-Scale Arrays through Multiple Chip-Addressing Modes.
Click here to view detailed specifications of the product.
IMS 2020 was scheduled to take place in Los Angeles, California from 21-26 June 2020. However, due to the COVID-19 pandemic, the event took place virtually from 4 - 6 August 2020. However, all presentations and materials will stay online until 30 September 2020.
Click here to see Everything RF's coverage of the event.
