Remcom, a leading provider of electromagnetic simulation and wireless prediction software, is showcasing two powerful tools in their latest software releases at IMS 2023 in San Diego this week. XFdtd 3D Electromagnetic Simulation Software and Wireless InSite 3D Wireless Prediction Software are packed with innovative features to enhance design capabilities and optimize wireless communication coverage.
XFdtd 3D Electromagnetic Simulation Software
In the latest version of XFdtd 3D, Remcom has introduced matching network tuning, a feature that enables users to easily adjust component values to meet design goals and understand circuit behavior. With the addition of an analysis workbench in XFdtd's schematic editor, designers now have a comprehensive toolset for matching network designs. The workbench allows for rapid manipulation of inductor and capacitor values using intuitive sliders, providing real-time visualization of the impact of different combinations. This functionality simplifies the process of identifying a favorable match while also analyzing the matching network's sensitivity to component tolerance. Fixed band matching and tunable matching for devices operating in different frequency bands are among the use cases for this new feature.
Jeff Barney, XFdtd product manager, expressed his excitement about the expanded capabilities of XFdtd, stating, "Remcom continues to broaden XFdtd's capability for matching network design. The slider bar mechanism is a familiar approach for calibrating values and was developed with maximum usability in mind. We believe users will enjoy the experience and appreciate the convenience that XFdtd offers."
Wireless InSite 3D Wireless Prediction Software
In addition to the improvements in XFdtd, Remcom has also unveiled a new version of Wireless InSite 3D Wireless Prediction Software. This update includes propagation analysis for engineered electromagnetic surfaces (EES), allowing users to model passive metasurfaces designed to optimize wireless communication coverage by manipulating signal propagation. The ability to control the electromagnetic propagation environment is particularly crucial for emerging technologies like 6G and applications such as reconfigurable intelligent surfaces (RIS). Engineered electromagnetic surfaces enhance wireless coverage by redirecting RF wave propagation through printed conductive patterns on substrates. The new EES capability in Wireless InSite enables analysis of coverage improvements from static EES or a single configuration of a metasurface-based RIS.
Wireless InSite's X3D Model now incorporates the Ray-Optical EES Scattering Model developed by the Communications Research Centre Canada (CRC). This integration allows for ray-based electromagnetic propagation prediction of reflections, transmissions, and diffractions in complex multipath environments equipped with metasurfaces. Ruth Belmonte, project manager for Remcom's Wireless InSite product and the EES development project, highlighted the exciting possibilities of EES technology for solving propagation challenges in millimeter-wave bands. The integration of Remcom's and CRC's models provides a novel way to simulate and analyze the channel characteristics of passive electromagnetic metasurfaces in various environments.
The new software releases also bring several enhancements to MIMO (multiple-input, multiple-output) systems, aimed at improving 5G and WiFi performance. Support for multi-port S-parameters captures the degradation caused by mutual coupling between MIMO antenna elements, providing more realistic results. Additional MIMO features, such as receiver codebooks and extensions to MIMO spatial multiplexing, further enhance support for new wireless systems. Moreover, the direct import of multi-frequency antenna patterns simplifies the simulation of broadband or multi-band devices, allowing for more accurate analysis.
With these advancements, Remcom continues to push the boundaries of electromagnetic simulation and wireless prediction software, providing engineers and designers with powerful tools to optimize their designs and enhance wireless communication performance.
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