Integrated Device Technology has introduced its next-generation 10 Gbps-class millimeter wave (mmWave) modem for wireless infrastructure carrier class deployments for both access and backhaul applications. The RWM6050 is the first highly integrated mmWave dual modem (PHY + MAC + ADC/DAC + beam forming) targeting applications such as fixed wireless broadband access, WTTx (Wireless To The Edge), small cell backhaul, 5G service and other emerging applications.
The RWM6050 will initially support operation in the 57 to 71 GHz band and expand support to other microwave and mmWave frequency bands in the future. It can be paired with mmWave RF chipsets to deliver multi-gigabit throughput at several hundred meters distance. It is highly configurable with a radio interface that provides easy integration with RF solutions.
Some of the key features of the RWM6050 are the dual modem and the mixed-signal front-end integration. These features deliver a uniquely cost-effective and power-efficient solution. Each modem in the RWM6050 will produce point-to-point and point-to-multipoint links to simplify network planning and the architecture for fixed wireless networks and 5G/LTE small cells. IDT plans to introduce additional modems as well as partner transceiver devices to offer customers a complete end-to-end solution.
Key Features of the RWM6050 include:
- Dual modem
- Multi-gigabit data rates with link adaptive operation
- Phased array antenna with advanced beamforming
- Configurable radio interface
- Flexible modulation and channelization
- Integrated network synchronization
The RWM6050 uses a standard 28 nm CMOS process and comes in a compact 19 x 19 mm 484-FCBGA package. IDT expects to make the RWM6050 sample and development kit available in the second quarter of 2017. For more information, click here.
