Qualcomm Technologies has announced radio frequency front-end (RFFE) design wins with a host of leading original equipment manufacturers (OEM), including Google, HTC, LG, Samsung and Sony Mobile. Qualcomm's rich portfolio of RF front-end platform solutions is designed to help OEMs deliver advanced mobile devices at scale and with accelerated time to commercialization. The strength of the company’s design pipeline supports the value of the its modem-to-antenna solutions. Qualcomm is the first technology provider to produce the hardware and software needed to deliver a comprehensive modem-to-antenna system solution to OEMs, which includes new QPM26xx series gallium arsenide (GaAs)-based power amplifier modules including duplexers (PAMiDs), envelope tracker, antenna tuners, antenna switches and discrete and integrated filter modules.
The RF front-end is critical to the mobile experiences end-users expect from their devices and for enhancing future advancements across the mobile industry. Complementing its leading modem technology for next generation mobile devices, Qualcomm's RF front-end portfolio delivers leading mobile solutions that support groundbreaking technologies, such as Gigabit LTE, 4x4 MIMO and LTE Advanced, and is crucial to the evolution and commercialization of 5G technologies in 2019.
Qualcomm Technologies’ strong RF front-end design pipeline represents the culmination of recent steps in their business strategy to develop and commercialize comprehensive mobile solutions from the digital modem to the antenna. Following the February 2017 completion of the RF360 Holdings Singapore PTE. Ltd., joint venture between Qualcomm Incorporated and TDK Corporation, Qualcomm introduced a suite of comprehensive RF front-end products that added new and significant capabilities to its portfolio. These included its first gallium arsenide (GaAs) power amplifier modules, the next-generation Qualcomm TruSignal antenna tuning solution, premium-tier PAMiD modules, comprehensive 600 MHz band (B71) support with a low-band PAMiD module, TC- surface acoustic wave (SAW) diversity receives filter and duplexer, the extension of extending B71 capability to its GaAs MMPA products and a B71-optimized aperture tuner. Additionally, at a November 2017 groundbreaking event in Singapore, RF360 Holdings conducted a signing ceremony to expand production capacity at its key manufacturing production site dedicated to manufacturing RF front-end SAW structured wafers, as well as state-of-the-art Thin Film Acoustic Packaging.
With its comprehensive core of RF front-end technologies and the ability to provide the ecosystem a truly comprehensive solution, Qualcomm Technologies is uniquely positioned to address the rapidly expanding complexity and challenges of 4G and 5G.
