Richardson RFPD has announced the availability and full design support capabilities for the comprehensive RF power multi-chip module (MCM) portfolio for 5G mMIMO from NXP Semiconductors.
These devices are part of NXP’s 5G Airfast solutions product family and include LDMOS power amplifier modules, GaAs pre-driver modules and receiver modules for cellular frequency bands from 2.3 GHz to 3.8 GHz, with output power from 3W to 5W.
The fully integrated power amplifier modules feature advanced high-performance in-package Doherty, fully matched 50-ohm input/output, multiple gain stages, and a small footprint. This combination of features is ideal for scaling mMIMO 5G configuration up to 64T64R.
The RF power Multi Chip Modules include:
Power amplifier modules
AFSC5G37D37 (3.7 GHz band, +37 dBm Avg.)
AFSC5G35D37 (3.5 GHz band, +37 dBm Avg.)
AFSC5G35D35 (3.5 GHz band, +35 dBm Avg.)
AFSC5G26D37 (2.6 GHz band, +37 dBm Avg.)
AFSC5G23D37 (2.3 GHz band, +37 dBm Avg.)
Pre-driver modules
AFLP5G35645 (3.5 and 3.7 GHz bands, +29 dBm Avg.)
AFLP5G25641 (2.3 and 2.6 GHz bands, +29 dBm Avg.)
Receiver Modules
AFRX5G372 (LNA+switch for 3.5 to 5 GHz bands)
AFRX5G272 (LNA+switch for 2.3 and 2.6 GHz bands)
Click here for more information on these products.
