FM160-EAU

Cellular Module by Fibocom (92 more products)

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FM160-EAU Image

The FM160-EAU from Fibocom is a Cellular Module that operates in the Sub-6 GHz band. This module is compliant with the 3GPP Release 16, which is backward compatible with LTE/WCDMA network standards. It uses the Qualcomm’s Snapdragon X62 modem chipset to power the module and provides a data rate of 3.5 Gbps during downlink and 900 Mbps during uplink. . This FEM is also designed to support multi-constellation GNSS receiver (GPS/Galileo/GLONASS/BeiDou) that offers high-performance positioning and navigation along with a greatly simplified product design. It is equipped with a rich set of interfaces such as USIM, USB 3.1/3.0, PCIe 4.0, and PCM/I2S, thereby allowing more flexibility and ease of integration for customer-centric applications. This cellular module requires a DC supply of 3.8 V. It is available in an M.2 package that measures 30 x 52 x 2.3 mm and is ideal for CPE, STB, IPC, and ODU terminal applications. The module is able to provide mobile network coverage mobile in both Latin America and Europe.

Product Specifications

Product Details

  • Part Number
    FM160-EAU
  • Manufacturer
    Fibocom
  • Description
    NR Sub-6 Cellular Module for Network Terminal Applications

General Parameters

  • Region
    EMEA
  • 5G Bands
    n1, 3, 7, 28, 38, 40, 66, 78
  • Fallback
    NA
  • GNSS Integrated
    Yes
  • GNSS Standard
    GPS, Glonass, BeiDou, Galileo
  • AT Command
    Yes
  • LTE/4G Band
    LTE FDD: B1/3/5/7/8/28/66, LTE TDD: B38/40/42
  • UMTS/HSPA/3G/WCDMA Band
    WCDMA: B1/5/8
  • IoT
    Yes
  • MIMO
    Yes
  • MIMO Configuration
    4x4
  • Drivers
    Linux, Windows, Android
  • Form Factor
    M.2
  • Generation
    5G, 4G/LTE, 3G
  • Interface
    USB 3.1, 3.0, PCIe 4.0, GPIO, UIM, I2S, eSIM
  • Data Rate
    5.67 to 3500 Mbps
  • Datarate Download Link
    42 to 3500 Mbps
  • Datarate Uplink
    5.67 to 900 Mbps
  • Integrated Features
    GNSS, Antenna
  • Voltage
    3.135 to 4.4 V
  • Size
    30 x 52 x 2.3 mm
  • Operating Temperature
    -30 to 75 Degree C
  • Package Type
    Surface Mount
  • Processor
    Qualcomm Snapdragon® X62
  • Sms
    Yes
  • Voice
    Yes