The AIROC CYW55571 from Infineon Technologies is a 2.4/5/6 GHz Wi-Fi 6/6E (802.11ax) + Bluetooth 5.3 Combo Chip. It supports 1024-QAM modulation and delivers a data rate of up to 600 Mbps over a channel bandwidth of 20/40/80 MHz. This combo chip has been designed to offer exceptional high-quality audio/video streaming and seamless connectivity experiences in congested network environments and significantly reduce latency by operating in the 6 GHz spectrum. It reduces the total bill of materials (BOM) cost and overall board space, thereby bringing down the development costs and accelerating time-to-market. This SoC optimizes power at both the chip level and system level, delivering high performance beyond Wi-Fi 6/6E requirements.
The AIROC CYW55571 supports multiple signal processing and hardware features such as OFDM and MU-MIMO, TWT, and DCM with network offloading to conserve power. It also includes multilayer security and network intelligence for protection of individual subsystems through the whole product life-cycle. This tri-band SoC offers smart coexistence between Wi-Fi and Bluetooth or to external LTE and 15.4 radio. It integrates PCIe, SDIO, Bluetooth, UART, I2S, and PCM serial protocols for remote communication and supports both Linux and Android OS.
The AIROC CYW55571 is available in a standard SiP package that measures 10.00 x 10.00 x 1.26 mm and is ideal for digital cameras, security systems, AI-enabled, AR/VR, voice assist systems, smart speakers, gaming, and industrial gateway applications.
