The LM833 from LM Technologies is a 2.4 GHz Wi-Fi 802.11 (b/g/n) + Bluetooth 5.2 Combo Module that minimizes the bill of materials (BOM) cost and PCB space. It utilizes Infineon’s CYW43439 power chipset that enables the host controller interface (HCI) module to be compatible with the latest Android and Linux platforms. This module consists of an ARM Cortex-M3 microcontroller, Wi-Fi and Bluetooth radios, 640 KB ROM, 512 KB RAM, and crystal oscillators. It incorporates an intelligent coexistence mechanism for Wi-Fi 802.11 b/g/n via SDIO and Dual Mode Bluetooth® v5.2 via UART. The module comes with updated Bluetooth capabilities, WPA3, DPP for Wi-Fi Easy Connect, enhanced Soft AP, and a shared SDIO host interface for Wi-Fi and Bluetooth radios.
This combo module supports various security features such as WEP, WPA, WPA2, WPA3, WMM, WMM-PS (U-APSD), WMM-SA, WAPI, AES (hardware accelerator), and TKIP (host-computed) for Wi-Fi, and integrates a secure simple paring mechanism for Bluetooth. It can be operated in Ad hoc mode, infrastructure mode, software AP, and Wi-Fi Direct in Wi-Fi mode, with Piconet and Scatternet topology support for Bluetooth mode. This module uses various digital modulation schemes such as CCK, DQPSK, 64-QAM, 16-QAM, QPSK, DBPSK, and BPSK along with OFDM and DSSS for spread spectrum.
This WEEE-compliant module delivers an output power of 17 dBm with a data rate of 11 Mbps (Wi-Fi) and 1 Mbps (Bluetooth). The LM833 is available in an enclosure that measures 19 x 12 x 2 mm and requires a DC supply of 1.8 to 4.8 V.
