The FastConnect 7900 from Qualcomm is a 2.4/5/6 GHz Integrated Wi-Fi 7 + Bluetooth® 5.4 + Ultra-Wideband (UWB) Module. It supports a range of technologies to enable users with comprehensive proximity awareness capabilities. This module implements High Band Simultaneous (HBS) Multi-Link with UWB and Bluetooth Channel Sounding to seamlessly find nearby devices like earbuds, smart tags, or other mobile devices. It employs all-new RF front-end modules (FEMs), including the Qualcomm® QXM1093/6 which enables up to 50% power savings, and the highly integrated Qualcomm® QXM1099/98 HBS modules with a 50% reduction in size on customer PCB for modem-to-antenna optimizations and longer battery life.
The FastConnect 7900 enables Qualcomm® Expanded Personal Area Network Technology (XPAN) and Snapdragon Seamless™ experience, a cross-platform technology enabling seamless linking of multiple devices across multiple operating systems, sharing peripherals and data. With these technologies, high-bitrate music streaming can be delivered over Wi-Fi at ultra-low power, from 96 kHz to 192 kHz. The Qualcomm XPAN can also support high-quality audio, and HBS utilizes two simultaneous high-band connections to ensure excellent audio experiences with robustness. It supports Bluetooth 5.4, spatial audio, and ANT+ along with multi-stream audio support for true wireless earbuds.
The FastConnect 7900 supports Wi-Fi 7/6E/6 generations and delivers a data rate of up to 5.8 Gbps using 4K QAM modulation and 320 MHz channel bandwidth (single channel or 160 + 160 with High Band Simultaneous). It supports IEEE 802.15.4z, FiRA and CCC UWB standards with 1 Transmit and 3 Receive chains and supporting TOF and AOA measurements. This AI-optimized module is based on a 6 nm process node and is suitable for use in mobile, compute, and XR experiences.
