RF & Microwave Laminates - Page 7

222 Laminates from 9 Manufacturers meet your specification.
Description:Low Loss Laminate for High Speed Digital Applications Beyond 100 Gb/s
Dk (Dielectric Constant):
3.02
Df (Dissipation Factor):
0.0021
Tg:
200 Degrees C
Td:
380 Degrees C
Thickness:
0.6 to 0.05 mm(0.002 to 0.018 In.)
more info
Description:3.4 (Dk), 250 Degrees (Tg), RF Laminate Up to 12 GHz
Dk (Dielectric Constant):
3.4
Df (Dissipation Factor):
0.003
Tg:
250 Degrees
more info
Description:2.2 to 3.4 W/m*K Copper Thermally conductive Laminates & Prepreg
Tg:
90 to 130 Degree C
Td:
340 to 380 Degree C
Thickness:
0.003, 0.004, 0.006, 0.008 Inches
more info
Description:High Performance Laminates for Microstrip Base Station Antennas
Dk (Dielectric Constant):
2.97
Df (Dissipation Factor):
0.0021
Td:
550 Degrees C
Thickness:
0.762 mm, 1.524 mm
more info
Description:TLG/TPG Laminates and Prepregs for High-Speed Digital and RF Multilayer, Ultra-thin core for digital multilayer
Dk (Dielectric Constant):
2.87 - 3.0
more info
Description:Woven, Glass-Reinforced PTFE
Dk (Dielectric Constant):
2.08-2.33 at 10 GHz
more info
Dk (Dielectric Constant):
4
Df (Dissipation Factor):
0.017
Tg:
260 °C
Td:
416 °C
more info
Description:3.31 (Dk), 200 Degrees (Tg), RF Laminate from 10 MHz to 110 GHz
Dk (Dielectric Constant):
3.31
Df (Dissipation Factor):
0.0023
Tg:
200 Degrees
more info
Description:2.2 W/m*K Aluminium Thermally Conductive Laminate
Dk (Dielectric Constant):
5.1
Df (Dissipation Factor):
0.014
Tg:
130 Degree C
Td:
380 Degree C
Thickness:
0.6, 0.8, 1, 1.2, 1.5, 2, 3 mm
more info
Description:3.3 Dk Low Loss, Spread Glass Reinforced Laminates
Dk (Dielectric Constant):
3.3
Df (Dissipation Factor):
0.0030 to 0.0036
Tg:
389 Degrees C
Td:
280 Degrees C
Thickness:
0.064 mm, 0.076 mm, 0.101 mm
more info

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