RF & Microwave Laminates - Page 8

222 Laminates from 9 Manufacturers meet your specification.
Description:HT 1.5 RF & Microwave Bonding Film, Thermoplastic bonding film
Dk (Dielectric Constant):
2
Df (Dissipation Factor):
0.0025
more info
Description:Cyanate Ester with Quartz Fabric
Dk (Dielectric Constant):
3.2 at 10 GHz
Tg:
250 °C
more info
Dk (Dielectric Constant):
4
Df (Dissipation Factor):
0.017
Tg:
250 °C
Td:
383 °C
more info
Description:3.62 (Dk), 185 Degrees (Tg), RF Laminate from 10 MHz to 110 GHz
Dk (Dielectric Constant):
3.62
Df (Dissipation Factor):
0.0046
Tg:
185 Degrees
more info
Description:2.2 to 3.4 W/m*K Copper High Thermal Conductivity Laminates & Prepreg
Tg:
170 to 190 Degree C
Td:
340 to 375 Degree C
Thickness:
0.002, 0.003, 0.004, 0.006, 0.008, 0.012 Inches
more info
Description:High Frequency, Low Cost Ceramic Laminates Fabricated Using FR-4 Processes
Dk (Dielectric Constant):
3.33 to 3.53
Df (Dissipation Factor):
0.0021 to 0.0037
Tg:
280 Degrees C
Td:
390 to 425 Degrees C
more info
Description:TLX RF & Microwave Laminate, Low DK base material
Dk (Dielectric Constant):
2.45 - 2.65 +/- 0.04
more info
Description:UL 94 V-0 Toughened Polyimide
Dk (Dielectric Constant):
3.8 at 10 GHz
Tg:
250 °C
more info
Dk (Dielectric Constant):
4
Df (Dissipation Factor):
0.0198
Tg:
250 °C
Td:
383 °C
more info
Description:3.8 (Dk), 176 Degrees (Tg), RF Laminate from 10 MHz to 110 GHz
Dk (Dielectric Constant):
3.8
Df (Dissipation Factor):
0.007
Tg:
176 Degrees
more info

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