RF & Microwave Laminates - Page 9

222 Laminates from 9 Manufacturers meet your specification.
Description:7 W/m*K Copper Metal Base Laminate
Dk (Dielectric Constant):
4.8
Df (Dissipation Factor):
0.016
Tg:
100 Degree C
Td:
380 Degree C
Thickness:
0.003, 0.004, 0.006 Inches
more info
Description:Ceramic Filled, Woven Glass Reinforced Laminates for 5G and mmWave Applications
Dk (Dielectric Constant):
2.94 to 3.10
Df (Dissipation Factor):
0.0015
Td:
500 Degrees C
Thickness:
0.0762 to 0.254 mm (3 to 10 mils)
more info
Description:Aluminium and copper backed IMS materials for LED applications
more info
Description:non-MDA Polyimide
Dk (Dielectric Constant):
3.8 at 10 GHz
Tg:
260 °C
more info
Dk (Dielectric Constant):
4
Df (Dissipation Factor):
0.017
Tg:
260 °C
Td:
416 °C
more info
Description:3.8 (Dk), 200 Degrees (Tg), RF Laminate from 10 MHz to 110 GHz
Dk (Dielectric Constant):
3.8
Df (Dissipation Factor):
0.007
Tg:
200 Degrees
more info
Description:4.2 W/m*K Copper Metal Base Laminate
Dk (Dielectric Constant):
4.8
Df (Dissipation Factor):
0.016
Tg:
180 Degree C
Td:
400 Degree C
Thickness:
0.002, 0.003, 0.004, 0.006, 0.008 Inches
more info
Description:Low Loss Laminates for High-Frequency Circuits
Dk (Dielectric Constant):
3.48 (Process), 3.66 (Design)
Df (Dissipation Factor):
0.0037
Tg:
280 Degrees C
Td:
390 Degrees C
Thickness:
0.102 to 1.542 mm
more info
Description:TLY RF & Microwave Laminate, Military grade very low DK base material
Dk (Dielectric Constant):
2.17 - 2.20 +/- 0.02
Df (Dissipation Factor):
0.0009
more info
Description:non-MDA Toughened Polyimide
Dk (Dielectric Constant):
3.5 at 10 GHz
Tg:
260 °C
more info

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