| New IoT Products . |
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| 3GPP Rel-17 Based 5G RedCap IoT Module with GNSS Support | |
Cellular Module
from Cavli Wireless
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| The CQM220 from Cavli Wireless is a 5G RedCap Module compatible with the 3GPP Rel-17 standards for IoT and M2M applications. It delivers a datarate of up to 226 Mbps (downlink) and 121 Mbps (uplink). This module has integrated GNSS support and an optional integrated eSIM providing global connectivity via the Cavli Hubble Device and Connectivity management platform. |
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| Multi-Chip, Multi-Band System-in-Package for 5G Massive IoT Platforms | |
Cellular Module
from Sequans Communications
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| The Monarch 2 from Sequans Communications is a Multi-Chip, Multi-Band System-in-Package (SiP) that supports 5G massive IoT (LTE-M/NB-IoT) platforms. It is based on the 2nd generation of Sequans’ Monarch LTE Cat M1/NB1/NB2 chipsets and consists of an entire front-end, transceiver, power management, RAM memory, crystals, and baseband modem for an LTE multi-band radio operating from 699 to 2200 MHz. |
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| 405 MHz Multi-mode 4G LTE Chipset with NTN Support | |
Cellular Module
from GCT Semiconductor
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| The GDM7243SL from GCT Semiconductor is a Multi-mode 4G LTE Chipset that supports 450 MHz and NTN bands. This 3GPP Rel-14-based chipset consists of an RF transceiver and modem and allows switching between NTN and NB-IoT, CatM, Cat1bis, Cat1, and/or Cat4. It is also compatible with the CBRS spectrum and covers 478 to 698 MHz (TVWS bands). |
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| Wi-Fi HaLow + MCU SoC from 750 to 950 MHz | |
Wireless Chipset
from Newracom
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| The NRC7292 from Newracom is a Wi-Fi HaLow + MCU SoC (System on Chip) that operates from 750 to 950 MHz. It supports a data rate of up to 15 Mbps and is compliant with the IEEE 802.11ah Wi-Fi HaLow standards. This SoC has an ARM Cortex-M3 CPU for customer applications and an ARM Cortex-M0 for WLAN. It has a fully integrated on-chip 11ah modem, RF transceiver, processor, and memory. |
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| Low power SiP with integrated LTE-M/NB-IoT and DECT NR+ modem, and GNSS | |
Cellular Module
from Nordic Semiconductor
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| The nRF9161 from Nordic Semiconductor is a highly integrated System-in-Package (SiP) solution, specifically designed for cellular IoT and DECT NR+ applications. It leverages low-power LTE technology, advanced processing capabilities, and robust security features, to provide unparalleled performance and versatility. It supports 3GPP release 14 LTE-M/NB-IoT and DECT NR+. |
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| Integrated 2.4 GHz Wi-Fi 7 Front-End Module for IoT Applications | |
Front End Module
from Qorvo
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| The QPF4257 from Qorvo is a 2.4 GHz Wi-Fi 7 Front-End Module (FEM). It consists of a 2.4 GHz power amplifier (PA), a single pole double throw (SPDT) switch, a bypassable low noise amplifier (LNA), RF coupler, and a DC logarithmic power detector in a single package. The performance of this FEM is focused on optimizing the PA for a supply voltage of 5 V that conserves power consumption while maintaining high linear output power and edge throughput. |
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| UWB Laser Direct Structuring (LDS) Antenna from 6 to 8.5 GHz | |
Antenna
from KYOCERA AVX
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| The 9002305L0-L01K from KYOCERA AVX is a Surface-Mount UWB Antenna that operates from 6 to 8.5 GHz. It is manufactured using Laser Direct Structuring (LDS) technology, which offers a streamlined and efficient process for creating complex 3D circuits on a myriad of substrates. This antenna is characterized by its phase stability, which remains the same in all directions around the antenna. |
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| Omnidirectional Co-Linear Antenna from 27 to 29 GHz for 5G Applications | |
Antenna
from TMYTEK
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| The ANT-COCO-2729-BEK28 from TMYTEK is a Coaxial Co-linear (COCO) Antenna that operates from 27 to 29 GHz. It has an omnidirectional beamwidth in the horizontal plane and a vertical 3 dB beamwidth of 25°. This antenna has a minimum return loss of 10 dB, cross-polarization of 20° and provides a gain of 7.5 dB. This antenna measures 66.5 (H) x 12.5 (Dia.) mm and has 2.92 mm (K-type) connectors. |
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| 2.4/5/6 GHz WLAN (Wi-Fi) and Bluetooth® Device Testing Set | |
RF Test Set
from NOFFZ Technologies
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| The IoT Test Node ITN 1000 from NOFFZ Technologies is a WLAN (Wi-Fi) and Bluetooth® Device Testing tool. It is suitable for 2.4/5/6 GHz Wi-Fi 6E (802.11ax), 2x2 MIMO, and Bluetooth® 5.2 BDR/EDR/BLE standards. This testing tool is designed for automated testing and can be used for development, prototyping, validation and production testing of wireless devices. |
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| 5G Wireless Module for Home, Enterprise, and Manufacturing Applications | |
Cellular Module
from Fibocom
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| The FG190W-NA from Fibocom is a 5G Wireless Module that is compliant with the 3GPP Release 17 standard. It delivers a downlink data rate of up to 6.18 Gbps and an uplink data rate of up to 900 Mbps. This module supports global 5G Sub-6, LTE FDD/TDD, UMTS & CDMA bands, and has 4 antennas. It requires a DC supply of 3.8 V and can be controlled via USB 3.1/3.0/2.0, PCIe 4.0/3.0, UIM, and I2S interfaces. |
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| Sub-6 GHz 5G/LTE-Advanced Module with L1-Band GNSS Support | |
Cellular Module
from Telit Communications
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| The FE990B34/40 from Telit Cinterion is a Sub-6 GHz 5G/LTE-Advanced Module. It supports 5G sub-6 GHz technology with Gigabit LTE and WCDMA and includes a state-of-the-art multi-constellation GNSS receiver. This module leverages Qualcomm® Snapdragon® X72 5G Modem-RF System and is compliant with 3GPP 5G Release-17 5G deployments. |
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| Low/Mid-Band Cat M1/NB-IoT Module for Japan | |
Cellular Module
from Murata
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| The Type 1WG (LBAD00XX1WG) from Murata is a Cat M1/NB-IoT Module that supports LTE low and mid bands. It is based on the Altair ALT1250 chipset and has an integrated 26 MHz (TCXO) and 32 KHz (X’Tal) system clock. This module meets the certification standards in Japan and supports GPS/GNSS, OpenMCU, Integrated SIM & NIDD (for SoftBank) for NB-IoT. |
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| 2.4 GHz Wi-Fi 6 + Bluetooth 5.4 LE Combo IC for IoT Applications | |
Wireless Chipset
from Infineon Technologies
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| The AIROC CYW55511 from Infineon Technologies is a Single-Band 2.4 GHz Wi-Fi 6 + Bluetooth Low Energy 5.4 Combo IC. This integrated, power-efficient and cost-effective design offers a balance of advanced Wi-Fi 6 and Bluetooth/BLE features with performance and power savings. It has a 192 MHz Cortex M33 core processor and supports OFDMA, MU-MIMO, TWT, BSS Coloring and DCM technologies. |
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| 2.4 GHz Multiprotocol Wireless SoCs for Mesh IoT Connectivity | |
Wireless Chipset
from Silicon Labs
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| The EFR32MG24 Series 2 from Silicon Labs are 2.4 GHz Multiprotocol Wireless SoCs that support mesh IoT wireless connectivity using Bluetooth LE 5.3, Matter, OpenThread and Zigbee protocols. These SoCs include an AI/ML hardware accelerator and Secure Vault to enable smart, robust, and energy-efficient products that are secure from remote and local cyber-attacks. |
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