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RF Packages - Page 23

570 RF Packages from 9 Manufacturers meet your specification.
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QP-QFN28-4MM-.4MM Image
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QP Technologies - QP-QFN28-4MM-.4MM

RF Package from QP Technologies
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Description:OmPP, QFN, Cavity Surface Mount 28 Lead RF Package
Type:
OmPP, QFN
Terminal Count:
28
Mounting:
Surface Mount
Package Material:
Semiconductor Molding Epoxy
Package Thickness:
0.800 mm
Package Size:
4 mm Wide
Terminal Type:
Lead
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C04-21467 Image
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Microchip Technology - C04-21467

RF Package from Microchip Technology
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Description:144-Lead Ceramic Quad Flat Pack (DHB) Without Trim and Form
Type:
CQFP
Terminal Count:
144
Mounting:
Surface Mount
Package Size:
22 x 22 x 6.25 mm
Terminal Type:
Lead
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LCC04833 Image
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Spectrum Semiconductor Materials - LCC04833

RF Package from Spectrum Semiconductor Materials
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Description:Ceramic, LCC Surface Mount 48 Lead RF Package
Type:
LCC
Cavity Size:
0.23 x 0.23 Inches (L x W)
Terminal Count:
48
Mounting:
Surface Mount
Terminal Type:
Lead
more info
QP-QFN28-5MM-.5MM Image
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QP Technologies - QP-QFN28-5MM-.5MM

RF Package from QP Technologies
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Description:OmPP, QFN, Cavity Surface Mount 28 Lead RF Package
Type:
OmPP, QFN
Terminal Count:
28
Mounting:
Surface Mount
Package Material:
Semiconductor Molding Epoxy
Package Thickness:
0.800 mm
Package Size:
5 mm Wide
Terminal Type:
Lead
more info
c04-00596a.pdf Image
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Microchip Technology - c04-00596a.pdf

RF Package from Microchip Technology
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Description:6-Lead Ceramic Land Grid Array
Type:
CLGA
Terminal Count:
6
Mounting:
Surface Mount
Package Thickness:
1.50 to 1.70 mm
Package Size:
3.2 x 2.5 x 1.7 mm
Terminal Type:
Lead
more info
KD-S85546-B Image
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KYOCERA - KD-S85546-B

RF Package from KYOCERA
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Description:20 Lead C-DIP(Ceramic Dual Inline Package)
Type:
C-DIP
Cavity Size:
6.6 x 4.83 mm
Terminal Count:
20
Mounting:
Through Hole
Package Size:
25.4 x 7.87 mm (C x D)
Terminal Type:
Lead
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LCC05203 Image
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Spectrum Semiconductor Materials - LCC05203

RF Package from Spectrum Semiconductor Materials
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Description:Ceramic, LCC Surface Mount 52 Lead RF Package
Type:
LCC
Cavity Size:
0.35 x 0.35 Inches (L x W)
Terminal Count:
52
Mounting:
Surface Mount
Package Size:
0.75 x 0.75 Inches (L x W)
Terminal Type:
Lead
more info
QP-QFN28-6MM-.65MM Image
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QP Technologies - QP-QFN28-6MM-.65MM

RF Package from QP Technologies
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Description:OmPP, QFN, Cavity Surface Mount 28 Lead RF Package
Type:
OmPP, QFN
Terminal Count:
28
Mounting:
Surface Mount
Package Material:
Semiconductor Molding Epoxy
Package Thickness:
0.800 mm
Package Size:
6 mm Wide
Terminal Type:
Lead
more info
C04-21303 Image
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Microchip Technology - C04-21303

RF Package from Microchip Technology
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Description:3-Lead Contact Package
Type:
LCP
Terminal Count:
3
Mounting:
Surface Mount
Package Size:
2.5 x 6.5 x 0.5 mm
Terminal Type:
Lead
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KD-S85766 Image
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KYOCERA - KD-S85766

RF Package from KYOCERA
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Description:16 Lead C-DIP(Ceramic Dual Inline Package)
Type:
C-DIP
Cavity Size:
7.62 x 4, .57 mm
Terminal Count:
16
Mounting:
Through Hole
Package Size:
20.32 x 7.87 mm (C x D)
Terminal Type:
Lead
more info
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