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everything RF
RF Components
RF Packages

RF Packages - Page 23

570 RF Packages from 9 Manufacturers meet your specification.

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QP Technologies - QP-QFN28-4MM-.4MM

RF Package from QP Technologies

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Description:OmPP, QFN, Cavity Surface Mount 28 Lead RF Package

Type:

OmPP, QFN

Terminal Count:

Mounting:

Surface Mount

Package Material:

Semiconductor Molding Epoxy

Package Thickness:

0.800 mm

Package Size:

4 mm Wide

Terminal Type:

Lead

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Microchip Technology - C04-21467

RF Package from Microchip Technology

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Description:144-Lead Ceramic Quad Flat Pack (DHB) Without Trim and Form

Type:

CQFP

Terminal Count:

144

Mounting:

Surface Mount

Package Size:

22 x 22 x 6.25 mm

Terminal Type:

Lead

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Spectrum Semiconductor Materials - LCC04833

RF Package from Spectrum Semiconductor Materials

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Description:Ceramic, LCC Surface Mount 48 Lead RF Package

Type:

LCC

Cavity Size:

0.23 x 0.23 Inches (L x W)

Terminal Count:

Mounting:

Surface Mount

Terminal Type:

Lead

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QP Technologies - QP-QFN28-5MM-.5MM

RF Package from QP Technologies

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Description:OmPP, QFN, Cavity Surface Mount 28 Lead RF Package

Type:

OmPP, QFN

Terminal Count:

Mounting:

Surface Mount

Package Material:

Semiconductor Molding Epoxy

Package Thickness:

0.800 mm

Package Size:

5 mm Wide

Terminal Type:

Lead

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Microchip Technology - c04-00596a.pdf

RF Package from Microchip Technology

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Description:6-Lead Ceramic Land Grid Array

Type:

CLGA

Terminal Count:

Mounting:

Surface Mount

Package Thickness:

1.50 to 1.70 mm

Package Size:

3.2 x 2.5 x 1.7 mm

Terminal Type:

Lead

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KYOCERA - KD-S85546-B

RF Package from KYOCERA

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Description:20 Lead C-DIP(Ceramic Dual Inline Package)

Type:

C-DIP

Cavity Size:

6.6 x 4.83 mm

Terminal Count:

Mounting:

Through Hole

Package Size:

25.4 x 7.87 mm (C x D)

Terminal Type:

Lead

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Spectrum Semiconductor Materials - LCC05203

RF Package from Spectrum Semiconductor Materials

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Description:Ceramic, LCC Surface Mount 52 Lead RF Package

Type:

LCC

Cavity Size:

0.35 x 0.35 Inches (L x W)

Terminal Count:

Mounting:

Surface Mount

Package Size:

0.75 x 0.75 Inches (L x W)

Terminal Type:

Lead

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QP Technologies - QP-QFN28-6MM-.65MM

RF Package from QP Technologies

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Description:OmPP, QFN, Cavity Surface Mount 28 Lead RF Package

Type:

OmPP, QFN

Terminal Count:

Mounting:

Surface Mount

Package Material:

Semiconductor Molding Epoxy

Package Thickness:

0.800 mm

Package Size:

6 mm Wide

Terminal Type:

Lead

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Microchip Technology - C04-21303

RF Package from Microchip Technology

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Description:3-Lead Contact Package

Type:

LCP

Terminal Count:

Mounting:

Surface Mount

Package Size:

2.5 x 6.5 x 0.5 mm

Terminal Type:

Lead

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KYOCERA - KD-S85766

RF Package from KYOCERA

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Description:16 Lead C-DIP(Ceramic Dual Inline Package)

Type:

C-DIP

Cavity Size:

7.62 x 4, .57 mm

Terminal Count:

Mounting:

Through Hole

Package Size:

20.32 x 7.87 mm (C x D)

Terminal Type:

Lead

Have a Custom Requirement?

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Spectrum Semiconductor Materials (244)
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Microchip Technology (57)
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Looking for RF Packages?

We have listed 570 RF Packages listed from 9 Manufacturers on everything RF.

Select specs based on what you need.

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View Products

Bandpass Filter

Lowpass Filter

Highpass Filter

Band Reject Filter

Diplexer

Triplexer

Flexible

Attenuators

Bends

Circulators

Directional Couplers

Isolators

Phase Shifter

Rotary Joints

Straights

Termination

Transitions

Waveguide to Coax Adapters

Rigid PCB Quotes

Flexible PCB Quotes

PCB Assembly Quotes

PCB Design Quotes

PCB Repair Quotes

PCB Stencil Quotes

RF Packages - Page 23

FiltersReset All

Manufacturers

Type

Terminal Type

Terminal Count

Mounting

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Looking for RF Packages?

Select specs based on what you need.