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RF Packages - Page 32

570 RF Packages from 9 Manufacturers meet your specification.
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CQJ06828 Image
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Spectrum Semiconductor Materials - CQJ06828

RF Package from Spectrum Semiconductor Materials
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Description:Ceramic Surface Mount 68 Lead RF Package
Type:
CQFP
Cavity Size:
0.4 x 0.4 Inches (L x W)
Terminal Count:
68
Mounting:
Surface Mount
Package Size:
0.95 x 0.95 Inches (L x W)
Terminal Type:
Lead
more info
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QP Technologies - 235-00050

RF Package from QP Technologies
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Description:QFN Surface Mount 16 Lead RF Package
Type:
QFN
Terminal Count:
16
Mounting:
Surface Mount
Package Size:
3 x 3 mm
Terminal Type:
Lead
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C04-027 Image
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Microchip Technology - C04-027

RF Package from Microchip Technology
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Description:8-Lead Ceramic DIP Dual In-Line
Type:
C-DIP
Terminal Count:
8
Mounting:
Drop-In
Package Size:
0.300 Inches
Terminal Type:
Lead
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KD-S76129-C Image
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KYOCERA - KD-S76129-C

RF Package from KYOCERA
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Description:16 Lead C-DIP(Ceramic Dual Inline Package)
Type:
C-DIP
Cavity Size:
4.57 x 3.81 mm
Terminal Count:
16
Mounting:
Through Hole
Package Size:
20.32 x 7.87 mm (C x D)
Terminal Type:
Lead
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CQJ06829 Image
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Spectrum Semiconductor Materials - CQJ06829

RF Package from Spectrum Semiconductor Materials
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Description:Ceramic Surface Mount 68 Lead RF Package
Type:
CQFP
Cavity Size:
0.3 x 0.3 Inches (L x W)
Terminal Count:
68
Mounting:
Surface Mount
Package Size:
0.95 x 0.95 Inches (L x W)
Terminal Type:
Lead
more info
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QP Technologies - 235-00052

RF Package from QP Technologies
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Description:QFN Surface Mount 24 Lead RF Package
Type:
QFN
Terminal Count:
24
Mounting:
Surface Mount
Package Size:
4 x 4 mm
Terminal Type:
Lead
more info
C04-008 Image
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Microchip Technology - C04-008

RF Package from Microchip Technology
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Description:40-Lead Ceramic Dual In-Line
Type:
C-DIP
Terminal Count:
40
Mounting:
Drop-In
Package Size:
0.600 Inches
Terminal Type:
Lead
more info
KD-S77032-H Image
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KYOCERA - KD-S77032-H

RF Package from KYOCERA
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Description:18 Lead C-DIP(Ceramic Dual Inline Package)
Type:
C-DIP
Cavity Size:
6.73 x 4.42 mm
Terminal Count:
18
Mounting:
Through Hole
Package Size:
22.86 x 7.87 mm (C x D)
Terminal Type:
Lead
more info
CQJ08401 Image
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Spectrum Semiconductor Materials - CQJ08401

RF Package from Spectrum Semiconductor Materials
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Description:Ceramic Surface Mount 84 Lead RF Package
Type:
CQFP
Cavity Size:
0.35 x 0.35 Inches (L x W)
Terminal Count:
84
Mounting:
Surface Mount
Package Size:
1.15 x 1.15 Inches (L x W)
Terminal Type:
Lead
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QP Technologies - 235-00053

RF Package from QP Technologies
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Description:QFN Surface Mount 40 Lead RF Package
Type:
QFN
Terminal Count:
40
Mounting:
Surface Mount
Package Size:
6 x 6 mm
Terminal Type:
Lead
more info
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