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RF Packages - Page 30

570 RF Packages from 9 Manufacturers meet your specification.
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CQJ04420 Image
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Spectrum Semiconductor Materials - CQJ04420

RF Package from Spectrum Semiconductor Materials
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Description:Ceramic Surface Mount 44 Lead RF Package
Type:
CQFP
Cavity Size:
0.3 x 0.43 Inches (L x W)
Terminal Count:
44
Mounting:
Surface Mount
Package Size:
0.65 x 0.65 Inches (L x W)
Terminal Type:
Lead
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QP-SOIC8-150-100×75 Image
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QP Technologies - QP-SOIC8-150-100×75

RF Package from QP Technologies
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Description:SOIC Surface Mount 8 Lead RF Package
Type:
SOIC
Terminal Count:
8
Mounting:
Surface Mount
Package Material:
Shin-etsu Kmc-2520l-m1
Package Thickness:
0.150 mm
Package Size:
100 x 75 mm
Terminal Type:
Lead
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C04-25504 Image
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Microchip Technology - C04-25504

RF Package from Microchip Technology
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Description:676-Ball Standard Ball Grid Array Package
Type:
BGA
Terminal Count:
676
Mounting:
Surface Mount
Package Size:
27 x 27 x 2.44 mm
Terminal Type:
Ball
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KD-SB9F89 Image
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KYOCERA - KD-SB9F89

RF Package from KYOCERA
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Description:28 Lead C-DIP(Ceramic Dual Inline Package)
Type:
C-DIP
Cavity Size:
6.35 x 6.35 mm
Terminal Count:
28
Mounting:
Through Hole
Package Size:
35.56 x 15.49 mm (C x D)
Terminal Type:
Lead
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CQJ04421 Image
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Spectrum Semiconductor Materials - CQJ04421

RF Package from Spectrum Semiconductor Materials
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Description:Ceramic Surface Mount 44 Lead RF Package
Type:
CQFP
Cavity Size:
0.43 x 0.43 Inches (L x W)
Terminal Count:
44
Mounting:
Surface Mount
Package Size:
0.65 x 0.65 Inches (L x W)
Terminal Type:
Lead
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20L-TSSOP-65P Image
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QP Technologies - 20L-TSSOP-65P

RF Package from QP Technologies
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Description:TSSOP Surface Mount 20 Lead RF Package
Type:
TSSOP
Cavity Size:
80 x 120 mm
Terminal Count:
20
Mounting:
Surface Mount
Package Size:
4.4 mm (Wide)
Terminal Type:
Lead
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C04-001 Image
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Microchip Technology - C04-001

RF Package from Microchip Technology
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Description:8-Lead Ceramic Dual In-Line
Type:
C-DIP
Terminal Count:
8
Mounting:
Drop-In
Package Size:
0.300 Inches
Terminal Type:
Lead
more info
KD-78516-D Image
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KYOCERA - KD-78516-D

RF Package from KYOCERA
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Description:24 Lead C-DIP(Ceramic Dual Inline Package)
Type:
C-DIP
Cavity Size:
9.65 x 9.65 mm
Terminal Count:
24
Mounting:
Through Hole
Package Size:
30.48 x 15.49 mm (C x D)
Terminal Type:
Lead
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CQJ04422 Image
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Spectrum Semiconductor Materials - CQJ04422

RF Package from Spectrum Semiconductor Materials
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Description:Ceramic Surface Mount 44 Lead RF Package
Type:
CQFP
Cavity Size:
0.43 x 0.43 Inches (L x W)
Terminal Count:
44
Mounting:
Surface Mount
Package Size:
0.65 x 0.65 Inches (L x W)
Terminal Type:
Lead
more info
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QP Technologies - 234-00083

RF Package from QP Technologies
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Description:QFN Surface Mount 100 Lead RF Package
Type:
QFN
Terminal Count:
100
Mounting:
Surface Mount
Package Size:
12 x 12 mm
Terminal Type:
Lead
more info
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